Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4
The Chemical Connection: Don’t Just Blame the EtcherGraphic Group Exhibiting at DesignCon Show
January 18, 2016 | Graphic GroupEstimated reading time: 1 minute
Graphic Group, a global manufacturer of high-technology printed circuit boards, will be exhibiting at the DesignCon Show, Santa Clara Convention Center, Santa Clara CA on January 20 & 21. Graphic will feature an assortment of complex Rigid, Rigid Flex, Flex Circuit and Flex Heater products for the Medical, Military, Aerospace, Automotive and Consumer industries.
The DesignCon Show features over 160 elite vendors and is the largest meeting of board designers, and is the ONLY event to address chip design engineers' chip/system/package challenges. Attendees will discover and evaluate the latest high-speed design tools, technologies and developments in the chip, board and system design industry. Graphic Group will be located in Booth 1251.
Graphic Group is one of the most technically competent manufacturers of high-technology printed circuit boards. With headquarters in the UK and full service manufacturing facilities in the USA and China, Graphic focuses on leading edge technology released to the most demanding international quality standards.
Graphic is an expert at prototyping and developing new "first to market" products. With facilities in the UK, United States and in China for medium to large volume production, the Graphic Group is able to offer the complete service from Application Engineering support to volume PCB manufacture.
HDI technology includes Rigid and Flex-Rigid Printed Circuit Boards with blind vias, buried vias, blind micro-vias, copper filled micro-vias, resin filled vias, stacked vias, sequential build-up, buried resistance and buried capacitance.
More Information can be found at www.graphic.plc.uk, www.graphic-usa.com and www.rigidflex-graphic.com
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