Shorter Product Lifecycles Fueling PCB Production Growth


Reading time ( words)

Research and Markets has announced the addition of the "Global Printed Circuit Board Market 2016-2020" report to their offering.

The report predicts that the Global PCB market will grow at a CAGR of 3.08% during the period 2016-2020.

A PCB is a thin board made of glass fiber/composite epoxy laminates (a combination of paper and glass fiber) on which integrated circuits (ICs), resistors, and transistors are mounted and connected electrically with wires or conductive pathways, which are etched or printed on the surface of the board.

The others application segment includes e-readers, business products and office equipment.

The report covers the present scenario and the growth prospects of the global printed circuit board (PCB) market. To calculate the market size, the report considers revenue generated from the sales of the PCB to the following application segments:

  • Aerospace and defense
  • Automotive
  • Cellular phone
  • Computing, storage, and peripherals
  • Medical, industrial, and instrumentation
  • Networking and communications
  • Other

This report has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Share

Print


Suggested Items

PCB Technologies Expands Capabilities

04/16/2021 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Arik Einhorn and Yaad Eliya of Israel-based PCB Technologies about how they’ve increased their capabilities down to 1 mil line and space to better support their customers from the military, aerospace, and medical markets.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/26/2021 | Andy Shaughnessy, Design007 Magazine
This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Bonding Hybrid Multilayer Constructions at Rogers Corporation

03/10/2021 | Real Time with...IPC
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.



Copyright © 2021 I-Connect007. All rights reserved.