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American Standard Improves Process; Integrates Orbotech Systems into West Chicago Facility
February 4, 2016 | American Standard CircuitsEstimated reading time: 1 minute
Anaya Vardya, CEO of American Standard Circuits, has integrated a complete set of Orbotech systems into his high tech PCB production facility. The series of equipment, which will improve ASC’s production capabilities includes Orbotech’s:
- Paragon 9800 Laser Direct Imaging System: A direct imaging PCB production system that delivers high throughput, accurate registration and superior image quality.
- Sprint 120 Inkjet System: Increases performance, flexibility and costs savings.
- InPlan and InSolver Impedance Solver Pre-production Engineering Solution: Supports full pre-production automation by ensuring the company maintains complete control of its processes through every operation.
When making the announcement Mr. Vardya said, “Our strategy is and has always been to provide all of our customers with the highest quality printed circuit boards on the market today. Whether they are metal-backed, flex/ rigid flex or high density boards, we are in the business of giving our customers the very best…so that they can be the very best. This year we have set an additional goal of being not only the top state of the art supplier but to also be the easiest PCB fabricator to work with. We are striving to make it easy to buy the best and this new suite of Orbotech equipment will go a long way towards making that happen.”
About American Standard Circuits
American Standard Circuits (ASC) prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, flex and rigid-flex PCBs as well as RF/microwave PCBs to the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide all technologies in a time-critical environment. Company qualifications include 9001:2008, MIL-PRF 31032, and ITAR registration. It holds a number of key patents for metal bonding processes as well. For more information, click here.
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