Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
BAE Systems, Shengyi Receive IPC Corporate Recognition Awards
March 22, 2016 | IPCEstimated reading time: 2 minutes
IPC – Association Connecting Electronics Industries bestowed its highest corporate honors to two member companies, BAE Systems and Shengyi Technology Co., Ltd. During a luncheon at IPC APEX EXPO, the IPC Stan Plzak Corporate Recognition Award was presented to BAE Systems and the IPC Peter Sarmanian Corporate Recognition Award to Shengyi Technology Co. Ltd.
Named after a former IPC Board Chairman who was a founding member of the Electronics Manufacturing Services Industry Management Council, the Stan Plzak Award recognizes an IPC member company in the electronics assembly industry that has taken the initiative to actively contribute to enhancing the industry while demonstrating support of IPC though participation in technical and/or management programs.
BAE Systems has been a member since 1996 and has made a big impact on IPC. More than two dozen of its staff members are active on 40 technical committees ranging from assembly and cleaning and coating to product assurance and printed electronics. In addition to standards committee participation, BAE Systems takes IPC training and certification very seriously. The company has more than 3,000 CIT, CIS, CID, CID+, and EMS certifications across all BAE locations.
The IPC Peter Sarmanian Corporate Recognition Award was named for former IPC Board Chairman Peter Sarmanian. This corporate award recognizes an IPC member corporation in the printed board industry that has taken a leadership role and made contributions to the industry while demonstrating support of IPC through participation in technical and/or management programs.
Shengyi Technology Co. Ltd. has been an IPC member since 1995, and since that time, the company has devoted many staff members to IPC standards development. Currently, more than a dozen Shengyi Technology employees provide leadership and technical expertise on 14 standards development committees dedicated to topics ranging from materials and performance to supplier declaration and technology roadmaps. The company has several Certified Instructor Specialists on staff at its facilities in Suzhou and Dongguan, China.
"For many years, both BAE Systems and Shengyi Technology Co., Ltd. have consistently provided staff resources to standards development and other committee initiatives. IPC as an association is privileged to have them in our membership," said John Mitchell, IPC president and CEO.
For more information on IPC's Corporate Recognition Awards and other honors presented at IPC APEX EXPO, contact Sandy Gentry, IPC communications, manager, at SandyGentry@ipc.org or +1-847-597-2871.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Smartphone Production Rises 4% QoQ in 2Q25 as Inventory Adjustment Ends
09/12/2025 | TrendForceTrendForce’s latest investigations reveal that global smartphone production reached 300 million units in 2Q25, up 4% QoQ and 4.8% YoY, driven by seasonal demand and the recovery of brands such as Oppo and Transsion following inventory adjustments.