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ESI Advances HDI Via Drilling Solutions Portfolio in APACMay 3, 2016 | Globe Newswire
Estimated reading time: 2 minutes
Electro Scientific Industries Inc. has announced that its nViant laser processing system has secured multiple customer placements in the high density interconnect (HDI) and substrate processing segments.
With global smartphone sales expected to grow by only seven percent in 2016 (Gartner), component manufacturers are under increasing market pressure to deliver advanced technology on smaller form factors, at reduced production costs. The placement of nViant systems demonstrates the Asian electronics manufacturing community's increasing acceptance of the superior manufacturing capabilities and greater flexibility that laser-based tools deliver.
"We are beginning to gain traction in the HDI and substrate manufacturing segments," said Dr. Michael Darwin, Vice President and General Manager of ESI's Component Processing Division. "These placements show good progress on our strategy to expand ESI's via drilling portfolio in the printed circuit board and substrate markets."
Demand in the smartphone and IoT markets is driving the need for miniaturization, while maintaining or increasing device functionality, all at the lowest possible cost. In order to take advantage of such trends, manufacturers are increasingly utilizing laser-based machining to either reduce the size of -- or increase the density of -- relevant features such as HDI microvias. The nViant system possesses the accuracy and throughput required to meet these new market needs, while doing so at the lowest possible cost of ownership as compared to other like equipment. As orders for emerging technologies increase, manufacturers with laser-based micromachining capabilities will be better equipped to address complex engineering and design specifications dictated by such product requirements as being bendable, stretchable, and reliable and accommodating a higher level of component density. A system like nViant is necessary to deliver circuitry that works within these evolving constraints, while also serving the immediate PCB and substrate processing requirements for today.
"nViant helps customers optimize their manufacturing capabilities to create interconnected solutions and deliver the next generation of circuitry," said Dr. Darwin. ESI remains deeply committed to its customers' success by providing direct engineering field support to drive continuous improvement and rapid technology advancement. Despite global market pressures and fierce competition, the company and Darwin are optimistic that these placements represent pivotal opportunities to demonstrate ESI's strength as an innovation partner in the APAC region.
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Oregon, with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.
Sanmina Corporation, a leading integrated manufacturing solutions company, announced that Jon Faust has been appointed Executive Vice President and Chief Financial Officer, effective December 18, 2023. Kurt Adzema, who previously held this role, will remain with the Company in an advisory capacity until January 5, 2024.
Northrop Grumman Corporation and Rohde & Schwarz signed a Memorandum of Understanding (MOU) at the Berlin Security Conference in Germany to collaborate on future resilient communications systems across Europe, including multifunction technologies and upgrades for 5th-to-4th generation aircraft interoperability.
RS Group Selects Siemens' EDA Simulation Technology for New Cloud Native DesignSpark Circuit Simulator12/05/2023 | PRNewswire
Siemens Digital Industries Software announced that the RS Group plc, a global provider of product and service solutions to more than 1.1 million industrial customers, has selected Siemens as its strategic electronic design automation (EDA) provider for its new, cloud native, DesignSpark Circuit Simulator tool – empowering users to streamline the design process.
Samsung Foundry certified Ansys' RaptorX on-chip electromagnetic (EM) solution for analyzing high-speed products manufactured with Samsung's 8nm (nanometer) LN08LPP Low Power Plus silicon process.
EMA Design Automation to Spin-Off IP & Services Group to Enable Digital Transformation for the Entire CAD Industry12/04/2023 | EMA Design Automation
EMA Design Automation, the world's premier EDA VAR, is spinning off their IP, content, and services group as a new company named Accelerated Designs, LLC with a focus on CAD agnostic solutions.