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Infineon CEO Jochen Hanebeck Becomes New ESIA President

12/07/2023 | ESIA
The General Assembly of the European Semiconductor Industry Association (ESIA), representing the European semiconductor industry and broader ecosystem, unanimously confirmed Jochen Hanebeck, Chief Executive Officer of Infineon Technologies, as the new ESIA President for a two-year mandate. Mr Hanebeck is succeeding NXP Semiconductors’ President and CEO Kurt Sievers.

SIA Statement on the Advancement of U.S.-Taiwan Tax Legislation

12/07/2023 | SIA
The Semiconductor Industry Association (SIA) released the following statement from vice president of government affairs David Isaacs in response to congressional action last week to advance legislation to resolve double taxation and other tax matters between the U.S. and Taiwan.

SEMI Launches Leadership Accelerator to Cultivate Future-Ready Microelectronics Industry Leaders

12/06/2023 | SEMI
SEMI announced the SEMI Leadership Accelerator to foster industry growth by assisting organizations in cultivating the next generation of leaders.

Amkor Announces US Advanced Packaging and Test Facility

12/05/2023 | Amkor Technology
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona.

Mycronic Receives SLX Mask Writer Order from a New Customer in Asia

12/05/2023 | Mycronic
Mycronic AB has received an order for an SLX mask writer from a new customer in Asia. The order value is in the range of USD 5-7 million. Delivery of the system is planned for the first quarter of 2025.
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