Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Goepel Free Webinar on Flexible Integration of AOI Systems into the THT Process is Available on Demand
May 25, 2016 | GOEPEL ElectronicEstimated reading time: 1 minute
The new GOEPEL webinar, “Individuality Desired? Flexible Integration of AOI Systems into the THT Process,” is now available on demand.
For any technologists who have assessed the diversity of components in use today, it is obvious: THT components are still present in significant numbers, despite the march toward miniaturization and increases in integration density.
What are we doing to guarantee assembly quality in production when utilizing these components? Usually, it is done through manual means, and often not well tested at all. Neither is acceptable under today’s quality demands. This fact appears more problematic, as THT components are still in use in sensitive areas, especially in the field of power electrics.
This 60-minute free webinar will answer questions about typical manufacturing problems and requirements for THT inclusive production processes and provide key insights regarding the structure of an inline AOI system for component and solder joint inspection of THT assemblies.
Learn about various integration options for the shortest quality loop and maximum effectiveness. Find out how inspection systems can be connected to company-internal MES and traceability systems, and which challenges and opportunities exist for AOI systems with respect to labeling of assemblies.
Learn about the possibilities for inline integration are offered by AOI systems for THT assemblies, how these systems adapt to the given production situation and what labeling of work pieces and assemblies is necessary for unambiguous assignment of errors and traceability.
To view this webinar now, visit Goepel’s “Individuality desired? Flexible Integration of AOI systems into the THT process” event page.
About GOEPEL electronic
GOEPEL electronic is a worldwide leading vendor of innovative electronic and optical test and inspection systems, being the market leader for professional JTAG/Boundary Scan solutions for Embedded System Access (ESA). A network of branch offices, distributors and service partners ensures the global availability of the products as well as the support of system installations worldwide. Founded in 1991 and headquartered in Jena/Germany, GOEPEL electronic employs currently more than 230 employees and generated a revenue of 30 Million Euro in 2015. GOEPEL electronic has continuously been ISO9001 certified since 1996 and has been honoured with TOP-JOB and TOP-100 awards for being one of the best medium-sized companies in Germany. GOEPEL electronic’s products won several awards in recent years and are used by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.