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Gold Plating Services Installs Technic ENEPIG Process
June 10, 2016 | TechnicEstimated reading time: 1 minute
Technic is pleased to announce the installation of the TechniPad Electroless Palladium process AT7015 at Gold Plating Services (GPS) in Santa Clara, California. GPS is a contract plating service specializing in precious metal plating for the printed circuit board industry.
With the addition of the electroless palladium to the existing TechniPad ENIG process, GPS is capable of providing a service exceeding both IPC 4552 for ENIG and IPC 4556 for ENEPIG. Both processes provide a reliable solderable and aluminium bondable surface. The electroless Pd provides a deposit for gold wire bondability as well as contact applications. The AT7015 has been engineered to provide the stability necessary for quick turn applications under all loading conditions.
About Gold Plating Services (GPS)
GPS provides quick turnaround plating services for ENIG, ENEPIG, deep tank soft and hard gold. GPS is a privately owned operation and has been in business for over 20 years. GPS is located at 3475 Victor Street in Santa Clara CA.
About Technic
Technic Inc. is a Rhode Island based, privately held corporation with over 900 employees worldwide. For more than 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.