-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ACE to Host Solderability and Lead Tinning Workshop in Arizona on August 10
June 29, 2016 | ACE Production Technologies Inc.Estimated reading time: 2 minutes
ACE Production Technologies Inc., a leading supplier of selective soldering systems, lead tinning systems and lead tinning services, is pleased to announce that its ACE Component Services group, in conjunction with Phase 4 Inc., will host a solderability testing and component lead tinning workshop in Arizona.
The workshop will be held on Wednesday, August 10, 2016 at TechShop, 249 East Chicago Street in Chandler, Arizona. This technical workshop will include a classroom process training session followed by a Q&A session as well as one-on-one discussion after the workshop is concluded.
Who Should Attend
- Process Engineers
- Manufacturing Engineers
- Quality Personnel
- Procurement Personnel
What They Will Learn
- Understanding the new J-STD-001 Rev F requirements
- Differences between solderability testing and component re-tinning
- Dip and look and wetting balance solderability test methods
- Motivation behind the need to hot solder dip components
- How the new J-STD-001 Rev F impacts you and your company
Solderability is no longer an option for many high reliability segments of the world’s electronics assembly industry. With implementation of the new Rev F of J-STD-001, solderability testing, gold removal and component re-tinning have become prerequisites for doing business and remaining competitive in the global marketplace. This classroom session focuses on the technical aspects of solderability testing and the component re-tinning process. Topics Include:
- Tin whisker mitigation
- Gold embrittlement and removal of gold plating
- RoHS and tin-lead component supply chain trends
- Solderability testing protocols
- MIL-STD-883 and J-STD-002 standards
- SMT and through-hole component re-tinning
- Legacy component refurbishing and RoHS to tin-lead conversion
- ANSI/GEIA-STD-0006 component re-tinning requirements
- Coplanarity and solder thickness
This much anticipated workshop entitled "Solderability and Lead Tinning for the 21st Century" will describe the removal of gold plating, replacing RoHS component finish with tin-lead, refurbishing of legacy components and tin whisker mitigation as the main drivers behind the increasing awareness of component re-tinning using the hot solder dip method. The recommendation that the re-tinning process be carried out using dual dynamic solder pots, controlled flux application and defined process control in accordance with ANSI/GEIA-STD-0006 to enhance component solderability will be discussed extensively.
This highly informative workshop is offered at no cost to all attendees courtesy of ACE Production Technologies and Phase 4 Inc. and covers all aspects of the solderability testing and component re-tinning processes. For more information about this one of a kind solderability testing and component lead tinning workshop, or to register for the workshop, contact Tom Dunn at tdunn@phase4inc.com or call either 480-966-2018 or 602-524-6431.
About ACE
ACE Production Technologies Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information, click here, call 509-924-4898 or email sales@ace-protech.com..
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.