IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2017

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IPC — Association Connecting Electronics Industries has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017. The extended deadline is July 8, 2016.

The industry’s premier conference and exhibition for the electronic interconnection industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Nokia, Ericsson, Indium, Flextronics, Intel and MacDermid have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

3D Printing in Electronics Manufacturing Automation in Electronics Manufacturing Adhesives Advanced Technology Area Array/Flip Chip/0201 Metric Assembly and Rework Processes BGA/CSP Packaging Black Pad and Other Board Related Defect Issues BTC/QFN/LGA Components Business & Supply Chain Issues Cleaning Conformal Coatings Corrosion Counterfeit Electronics Design Electromigration Electronics Manufacturing Services

Embedded Passive & Active Devices Environmental Compliance Graphene in Electronics Manufacturing Lean Six Sigma LED Manufacturing Failure Analysis Flexible Circuitry HDI Technologies Head-on-Pillow Board and Component Warpage High Speed, High Frequency & Signal Industry 4.0 Integrity Lead-Free Fabrication, Assembly & Reliability Miniaturization Nanotechnology Optoelectronics Packaging & Components

PCB Fabrication PCB and Component Storage & Handling Performance Quality & Reliability Photovoltaics PoP (Package-on-Package) Printed Electronics Reshoring RFID Circuitry Robotics Soldering Surface Finishes Test, Inspection & AOI Tin Whiskers 2.5-D/3-D Component Packaging Underfills Via Plugging & Other Protection Wearables

A 200-400 word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results. In addition, course proposals are solicited from individuals interested in presenting half-day or full-day professional development courses on design, lead-free technologies, manufacturing processes, process improvement, materials, test and reliability.

Technical conference paper abstracts are due July 8, 2016 and course proposals are due August 5, 2016. To submit an abstract or course proposal, click here.

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