Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2017
July 1, 2016 | IPCEstimated reading time: 1 minute
IPC — Association Connecting Electronics Industries has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017. The extended deadline is July 8, 2016.
The industry’s premier conference and exhibition for the electronic interconnection industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Nokia, Ericsson, Indium, Flextronics, Intel and MacDermid have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”
Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:
|
|
|
A 200-400 word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results. In addition, course proposals are solicited from individuals interested in presenting half-day or full-day professional development courses on design, lead-free technologies, manufacturing processes, process improvement, materials, test and reliability.
Technical conference paper abstracts are due July 8, 2016 and course proposals are due August 5, 2016. To submit an abstract or course proposal, click here.
Share on:
Suggested Items
Delta SEA Partner Event 2025 Unites Regional Partners to Embrace a “Future Ready” Vision
07/03/2025 | Delta ElectronicsDelta Electronics (Thailand) Public Company Limited, successfully hosted its Delta SEA Partner Event 2025: Future Ready at Delta Chungli Plant 5, Taiwan on June 10 – 11 , 2025.
Murray Percival Company Welcomes CeTaQ to Its Line Card, Optimizing SMT Processes for PCB Manufacturers
07/03/2025 | Murray Percival CompanyThe Murray Percival Company, a trusted supplier to the Midwest's electronics industry, is pleased to announce that it has added CeTaQ to its line card, a global expert in Surface Mount Technology (SMT) measurement systems.
RBB’s Jeff Schartiger Appointed to SMTA Ohio Board as Technical Advisor
07/03/2025 | RBBRBB, a trusted leader in electronics manufacturing since 1973, is proud to announce that Jeff Schartiger, Operations Manager at RBB, has been appointed to the SMTA Ohio Chapter Board as a Technical Advisor.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
Eiyu Electronics Launches Pre-Assembled Module Product Line to Simplify Sourcing for Embedded Projects
07/02/2025 | BUSINESS WIREEiyu Electronics Co., Ltd., a Hong Kong-based electronic component trading company, today announced the official launch of its pre-assembled module product line, designed to help engineers and procurement teams save time when sourcing complex modular components.