-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueWet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
The 21st Century PCB Factory– Designed to Eliminate Offshore Cost Advantages
July 1, 2016 | Alex Stepinski, WHELEN ENGINEERINGEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/5616/3122/1753/Alex_Stepinski.jpg)
Over 15 years have passed since North America and Europe ceased being the center of worldwide PCB fabrication and were supplanted by a Chinese market with low-cost labor, lax environmental requirements, and strong government support. In just a few short years, the superior offshore cost advantages of this new dynamic put volume PCB production in the West out of business, aside from the military and specialty technology applications contained in the few shops that continue to exist today.
Recently, however, the conditions that created the current equilibrium appear to be shifting again. In this new dynamic, automation, innovative green wastewater technologies, and next generation process equipment innovations have combined to make new factories capable of achieving rapid ROI for PCB fabrication almost anywhere in the world. This paper means to illustrate this new dynamic, and provide case study examples from the new greenfield installation at our captive facility in New Hampshire.
Read the full article here.
Editor's Note: This article originally appeared in the June 2016 issue of The PCB Magazine.
Suggested Items
Archer Delivers First Midnight Aircraft to The United States Air Force
08/16/2024 | BUSINESS WIREArcher Aviation Inc. announced it has delivered its first Midnight aircraft to the USAF to evaluate as part of its AFWERX Agility Prime contract valued at up to $142M..
MilDef to Deliver Rugged Displays to European Military Vehicle Manufacturer
08/14/2024 | CisionVia the acquisition of certain assets of Advanced Vision Technologies Ltd (AVT), MilDef has now been entrusted to deliver intelligent and rugged displays to key European land vehicle programmes.
CACI Awarded $319 Million Task Order to Provide Intelligence Systems Expertise to the U.S. Army
08/05/2024 | CAC, Inc.CACI International Inc announced that it has been awarded a five-year task order valued at up to $319 million to provide intelligence systems expertise to the U.S. Army, Communications-Electronics Command (CECOM), Software Engineering Center (SEC), Electronic Warfare and Sensors Directorate (IEWSD), Army Reprogramming Analysis Team-Program Office (ARAT-PO).
Airbus to Lead NATO Next Generation Rotorcraft Capability Concept Study
07/26/2024 | AirbusThe NATO Support and Procurement Agency (NSPA) has awarded a contract to Airbus Helicopters to lead a concept study in the frame of the Next Generation Rotorcraft Capability (NGRC) project under which the participants combine efforts to work on design, development and delivery of a medium multi-role helicopter.
Innovative and Cost-effective BGA Re-balling
07/23/2024 | Shavi Spinzi, Nano Dimension/EssemtecA new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.