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Japan’s OHISAMA Project Aims to Beam Solar Power from Space This Year

07/14/2025 | I-Connect007 Editorial Team
Japan could be on the cusp of making history with its OHISAMA project in its quest to become the first country to transmit solar power from space to Earth, The Volt reported.

Connect the Dots: The Future of PCB Design and Manufacturing

07/02/2025 | Matt Stevenson -- Column: Connect the Dots
For some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.

Project GENESIS Minimizes Ecological Footprint in Europe’s Semiconductor Industry

06/06/2025 | Fraunhofer IPMS
A pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing supply chain announces the launch of the GENESIS project.

INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect

05/30/2025 | iNEMI
One of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.

ICEFlight to Accelerate Maturation of Cryogenic Technologies for Hydrogen-Powered Flight

05/27/2025 | GKN Aerospace
GKN Aerospace is one of the project partners in ICEFlight (Innovative Cryogenic Electric Flight), a project aiming to contribute to the development of hydrogen-powered flight.
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