It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
White House Advances High-Performance Computing Initiative
August 3, 2016 | SIAEstimated reading time: 1 minute
The White House last week released a new strategic plan to implement the National Strategic Computing Initiative (NSCI) – a supercomputing research effort – across government agencies. The plan calls for greater collaboration among industry, academia, and the government to build an ecosystem that will enable advancements in high-performance computing.
High-performance computing uses supercomputers and advanced processing techniques to solve complex computational problems at extraordinary speeds through computer modeling, simulation, and data analysis. A recent report by the Information Technology & Innovation Foundation (ITIF) examined the many critical applications of high-performance computing and called on Congress and the Administration to advance policies that support it.
The White House plan focuses not only on building the world’s fastest supercomputers, but also on developing systems that can be deployed to agencies for research in grand challenges, including research that could benefit public health or the economy. The proposal calls for additional research in foundational technologies, like semiconductors, to be conducted by the National Science Foundation (NSF) and other agencies. It directs NSF to focus research on further miniaturization of CMOS technology and establish additional research to explore alternatives to CMOS.
Additionally, the plan highlights the recently announced Energy-Efficiency program (E2CDA) between NSF and the Semiconductor Research Corporation (SRC) as a model for public-private partnership to address the NSCI challenges. SIA and several member companies participated in a workshop on the NSCI at the White House on Friday, July 29.
SIA is currently working to bolster investments in semiconductor R&D and hopes that the NSCI will bring heightened attention to semiconductor research across government agencies. Policymakers should support research investments to advance high-performance computing and boost U.S. competitiveness and technology leadership.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.
Marco Pieters Appointed ASML Chief Technology Officer
10/09/2025 | ASMLASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.