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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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IPC Releases IPC-1601 Revision A
August 10, 2016 | IPCEstimated reading time: Less than a minute
To address industry needs and advancements, IPC has released revision "A" of IPC-1601, a critical update for the proper handling, packaging and storage of bare printed boards. This revision provides the necessary additions to match the growing requirements of the electronics industry, especially to protect printed boards from sources of contamination, physical damage, and electrostatic discharge (ESD) present during the fabrication process.
With topics ranging from moisture barrier bags, humidity indicator cards, product transport and the effects of baking, this revision includes updates that provide:
- requirements to reduce exposure to moisture and decrease physical damage while shipping
- requirements for packing necessary for printed boards especially sensitive to moisture
- special requirements that may apply for printed designs that are especially fragile or sensitive to environmental conditions
To download this revision, click here.
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IPC Excellence in Education Award: Zenaida Valianu
05/01/2025 | Nolan Johnson, I-Connect007Zenaida Valianu is the training manager at IPC who brings more than 25 years of expertise in standards and training development to her role. She has revolutionized IPC certification training programs by significantly enhancing their content with comprehensive curricula and engaging materials. She has also been instrumental in developing essential workforce training courses and contributing to various other initiatives.
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
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04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.