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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
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This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
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Frontline Announces InStack Design
September 13, 2016 | Frontline PCB SolutionsEstimated reading time: 1 minute
Frontline PCB Solutions, an Orbotech-Mentor Graphics company, today announced the launch of InStack Design, an industry-proven solution for designing complex stackups in minutes, taking all fabrication and SI constraints into account and enabling seamless electronic collaboration with board fabricators.
“Efficient designer-fabricator collaboration is essential in a world where time to market is central to the success of your business,” said Yovav Sameah, president of Frontline PCB Solutions. “Our parent company, Mentor Graphics, has a profound understanding of designer needs. Thanks to the strong cooperation between the two companies it seems logical to bring Frontline’s industry-proven PCB design planning tools to designers, allowing them to concentrate on functionality and signal integrity. Designers can now plan boards using the same tools as fabricators, shortening lead-time by eliminating lengthy exchanges with manufacturers. Designing stackups with the right tradeoffs will dramatically reduce time to market and improve product quality.”
InStack Design is a comprehensive solution for flex and rigid-flex stackups, integrating suppliers, materials, and processes to ensure manufacturability, seamless integration of design and fabrication, and accurate stackup design. Using standard industry materials or material libraries provided by the PCB suppliers themselves, designers can model and verify thickness, impedance, and losses quickly and precisely, even for the most complex multi-zone structures. InStack Design accelerates manufacturing and meets board requirements to produce more efficient, higher quality PCBs.
About Frontline PCB Solutions
Frontline is an Orbotech and Mentor Graphics software company, bringing together the power, knowledge, and stability of two world leaders and creating smart, future-oriented technologies and solutions for the PCB industry. Frontline has a strong track record of success, with more than 20 years’ experience and over 10,000 installations worldwide. Frontline offers its customers a complete preproduction solution, from design to manufacturing, and builds long-term partnerships with customers, offering ongoing training and consulting.
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Klaus Koziol - atgSuggested Items
I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec
02/12/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.
EMS Leadership Summit: A Smarter Way to Gather EMS Leaders
02/11/2026 | Nolan Johnson, SMT007 MagazineMark Wolfe is a career EMS and electronics expert, whose leadership has helped expand and improve the EMS Leadership Summit at APEX EXPO. Last year’s event received a huge approval rating from attendees: a whopping 96% said they’d be back. Not content to rest on those laurels, Mark and his team have put together a program that preserves the Summit’s strengths while finding ways to improve. In this interview, Mark makes a strong argument why EMS leadership at all levels should take a day to examine the wider picture of our industry.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Global Chips Market Hitting Record High Sales Figures in 2025
02/09/2026 | ESIAThe European Semiconductors Industry Association (ESIA) announced that global semiconductor sales reached US$ 791.69 billion in 2025, which means a marked 26.1% increase on a year-on-year basis. Semiconductor sales in the Europe reached US$ 54.46 billion in 2025, a 6.2% rise versus 2024.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/06/2026 | Nolan Johnson, I-Connect007Here’s the thing about time travel. You can’t just manipulate the time dimension; you have to move in three-dimensional space as well. That’s because Earth orbits a star, which orbits a galaxy, which is on its own path through three-dimensional space. Our planet follows a complex corkscrew-like path through the universe, covering great distances in just seconds. Build a time machine like HG Wells envisioned, and even a short jump in time means that Earth has moved, and you’re now floating in the void of space. Unsettling, to be sure.