-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Happy’s Essential Skills: Computer-Aided-Manufacturing, Part 1—Automation Protocols
September 14, 2016 | Happy HoldenEstimated reading time: 19 minutes

I have addressed automation planning previously in this series, so I hope by now you realize the difference between ‘automation’ and ‘mechanization.’ In printed circuit fabrication and assembly, most of what is advertised is mechanization. But when you get to assembly test, then you begin to see true automated solutions. The difference between the two is the networking and protocols that supply the information and data. An industry for us to look to as an example: our brothers in semiconductor fabrication. This industry has had fully automated factories since the mid-1980s.
INTRODUCTION
This column is dedicated to the automation protocols that currently exist and some new ones just coming on the market. In Part 2, I will present some examples from my own projects.
The ‘messages and recipe data’ needed for production scheduling-to-machine connections has evolved over the years. The selections to be covered here are:
- Serial RS-232C/RS-485
- Parallel IEEE-488/HP-IB
- MAPS™ protocol
- SECS I & SECII/GEM protocols
- OML
- IPC-2541
- LAN (IEEE-802.3 and TCP/IP)
- Wireless and IoT
Recipe-to-Machine and Machine-to-Machine
When I started working with automation control in 1970, we had ASCII characters in parallel cabling. So we started by using these printer and teletype protocols to control machines. Sometimes, we had only BCD to work with! Today you have the ‘lights-out-factory’ and Industry 4.0 initiatives. A lot of progress is the result of the automotive industry’s application of PLCs and robots to manufacturing. Figure 1 shows what the Germans foresee for Industry 4.0[1]. Figure 2 shows the 4-level hierarchy of CAM, while Figure 3 shows typical networked factory control units.
Figure 1: The scope of Industry 4.0 enables an intelligent plant (planet). (Source: Advantech)
Figure 2: Enterprise and plant control topology showing the 4-level hierarchy. (Source: Renesas Edge—Big Data in Manufacturing)
I was fortunate to be employed by Hewlett-Packard. Their 2116-model computers (and later, the 2110) were real-time-interrupt driven computers and ideal for machine control. HP had even developed a CNC machine control system but decided not to sell it since it did not fit their instrument or computer sales force’s experience. They sold all the CNC systems to Allen Bradley in Milwaukee, Wisconsin. Thus, I ended up working frequently with AB to buy back the software that HP had developed. This was serendipitous as AB introduced me to their programmable logic controller (PLC) technology. PLCs became a major tool in machine control.
Figure 3: Typical industrial automation controllers and PLCs. (Source: Wenatchee Valley College, Nevada)
Page 1 of 5
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.