-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Happy’s Essential Skills: Computer-Aided-Manufacturing, Part 1—Automation Protocols
September 14, 2016 | Happy HoldenEstimated reading time: 19 minutes

I have addressed automation planning previously in this series, so I hope by now you realize the difference between ‘automation’ and ‘mechanization.’ In printed circuit fabrication and assembly, most of what is advertised is mechanization. But when you get to assembly test, then you begin to see true automated solutions. The difference between the two is the networking and protocols that supply the information and data. An industry for us to look to as an example: our brothers in semiconductor fabrication. This industry has had fully automated factories since the mid-1980s.
INTRODUCTION
This column is dedicated to the automation protocols that currently exist and some new ones just coming on the market. In Part 2, I will present some examples from my own projects.
The ‘messages and recipe data’ needed for production scheduling-to-machine connections has evolved over the years. The selections to be covered here are:
- Serial RS-232C/RS-485
- Parallel IEEE-488/HP-IB
- MAPS™ protocol
- SECS I & SECII/GEM protocols
- OML
- IPC-2541
- LAN (IEEE-802.3 and TCP/IP)
- Wireless and IoT
Recipe-to-Machine and Machine-to-Machine
When I started working with automation control in 1970, we had ASCII characters in parallel cabling. So we started by using these printer and teletype protocols to control machines. Sometimes, we had only BCD to work with! Today you have the ‘lights-out-factory’ and Industry 4.0 initiatives. A lot of progress is the result of the automotive industry’s application of PLCs and robots to manufacturing. Figure 1 shows what the Germans foresee for Industry 4.0[1]. Figure 2 shows the 4-level hierarchy of CAM, while Figure 3 shows typical networked factory control units.
Figure 1: The scope of Industry 4.0 enables an intelligent plant (planet). (Source: Advantech)
Figure 2: Enterprise and plant control topology showing the 4-level hierarchy. (Source: Renesas Edge—Big Data in Manufacturing)
I was fortunate to be employed by Hewlett-Packard. Their 2116-model computers (and later, the 2110) were real-time-interrupt driven computers and ideal for machine control. HP had even developed a CNC machine control system but decided not to sell it since it did not fit their instrument or computer sales force’s experience. They sold all the CNC systems to Allen Bradley in Milwaukee, Wisconsin. Thus, I ended up working frequently with AB to buy back the software that HP had developed. This was serendipitous as AB introduced me to their programmable logic controller (PLC) technology. PLCs became a major tool in machine control.
Figure 3: Typical industrial automation controllers and PLCs. (Source: Wenatchee Valley College, Nevada)
Page 1 of 5
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.