The Marketing Minute: Blink and You'll Miss It … and Other Problems With One-shot Marketing
The Right Approach: Reflections on 50 Years in the Business, Part 1
It’s Only Common Sense: Control Your Market With Your Actions
Latest Articles
I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec
I-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.
Symposium Review: A Glimpse Into the Future of IC Substrates and Beyond
The Hong Kong Printed Circuit Association (HKPCA) and the Korea Printed Circuit Association (KPCA), with strong support from SEMI, presented “The Future of IC Substrates and Beyond Symposium 2025” at the Sands Expo and Convention Centre in Singapore in . The event brought together elite professionals, technical experts, and corporate leaders from across the global IC substrate industry chain to explore cutting-edge trends and innovative solutions shaping the future of the sector.
Advanced Electronic Packaging: How the Global Electronics Association Is Addressing Challenges and Needs in Malaysia
In November, more than 200 industry leaders, including government officials, regional domestic companies, multinational companies, and academic experts, gathered at the Olive Tree Hotel in Penang for the Advanced Electronic Packaging (AEP) Workshop, organized by the Global Electronics Association. With 15 expert speakers, three technical tracks, three expert panel discussions, and strong ecosystem participation, the workshop highlighted why advanced electronic packaging is central to the future of Malaysia’s semiconductor industry.
Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging
The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.
A Printed Electronics Roadmap With Komori’s Doug Schardt
At SEMICON West this year, I had the pleasure of speaking with Doug Schardt, Komori America’s director of Printed Electronics Business, who discussed how Komori has evolved from a traditional printing company to a leader in modern printing solutions, with a specific focus on printed electronics (PE) equipment and materials. He details the potential for Komori’s gravure offset printing, research into conductive inks, and why he believes AI chips are driving the future of printed electronics.
The New Energy Equation: Collaboration, AI, and the Future of Power Management
The compute power of artificial intelligence is revolutionizing nearly everything it touches, yet the tremendous demand and limited supply have put increasing pressure on energy sources to keep up the pace. Semiconductor fabs and other manufacturing businesses, in particular, must find innovative solutions to optimize their energy use and management. Power may be the hard barrier that will stop all progress if we can't find viable solutions. At SEMICON West, Mark Bidinger, president of commercial and industrial segments at Schneider Electric, shared his insights into this issue and potential solutions.
Inside the Fight for U.S. Advanced Packaging: Military Electronics Experts Weigh In
Modern warfare—driven by rapid evolution of UAVs, autonomous systems, and high-speed sensing—has made it clear that U.S. defense electronics must move beyond legacy architectures and embrace UHDI, advanced substrates, and next-generation interconnect technologies. In this roundtable discussion, two defense electronics experts outline a central challenge: The U.S. cannot field high-performance systems or maintain technological advantage while relying on overseas PCB, substrate, and component supply chains.
The Next Five Years of Thermal Substrates, Ceramics, and Thick-film PCBs
If you want a clean view of where thermal substrates and ceramic/thick-film electronics are headed, follow the heat. Power density is moving up and to the right across industries: EV traction inverters, fast chargers, AI data centers, radar, satellite payloads, medical imaging, and high-brightness LEDs. The next five years will be defined by designs that treat thermal performance as a first-order constraint, not an afterthought. Here’s what that means in practice.
I-Connect007 Announces the December Issue of Advanced Electronics Packaging Digest
Landing in inboxes Monday, Dec. 15, the next issue of Advanced Electronics Packaging Digest (AEPD) explores some of the most pressing questions shaping U.S. advanced electronics capability, from defense readiness to power constraints and the fast-moving world of printed electronics. This month, we spotlight the technologies, strategies, and industry perspectives driving next-generation manufacturing forward.
Voices of the Industry Features Elephantech’s Satoshi Konagai on the Future of Sustainable PCB Manufacturing
I-Connect007 is pleased to announce the release of the latest episode in its acclaimed podcast series, Voices of the Industry. In this episode, host Marcy LaRont speaks with Satoshi Konagai, Executive Officer and Head of Marketing of Elephantech, about the company’s groundbreaking additive manufacturing technology that’s reshaping the printed circuit board (PCB) industry.
How HDI/UHDI Manufacturing Converge With Interposers and Substrates
For decades, the PCB and the semiconductor package lived in separate universes. PCBs belonged to the world of board shops, panels, and assembly lines; packages belonged to semiconductor fabs and OSATs. Substrates and interposers, meanwhile, were niche system-level package “components” in the middle, largely invisible to the outside world. That separation is dissolving as definitions broaden. The rise of high-density interconnect (HDI) and its next-generation cousin, ultra HDI (UHDI), is pushing PCB manufacturing into territory once reserved for semiconductor packaging.
Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025
Discussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
As power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Interposers, Substrates, and Advanced Manufacturing
I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
HPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Advanced Packaging: Preparation is Now
In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in