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Build Better 2024 Summit: Creating a Vision for Future Tech

Most likely, there aren’t many manufacturing summits that take place on an aircraft carrier, so it was pretty impressive to be on the USS Hornet, with a beautiful view of the San Francisco harbor at Build Better 2024 on Wednesday, October 16, 2024. Billed as “the only manufacturing summit for engineering and operations leaders developing electronics”, the event was quite interesting.

Fall 2024 Issue of IPC Community Now Available

There’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way. Just for starters, our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.

The SD11 Inkjet Printer and Ventec Giga Solutions

Ventec expanded last year to provide greater portfolio solutions to its customers, all of which are aligned with Ventec’s core business in laminates and distribution products. I sat down with Ventec Giga Solutions’ Commercial Director Leigh Allinson, who is deeply rooted in both the PCB and supply chain sectors. He explores the innovative realms of the company and its cutting-edge SD11 inkjet printer. Leigh brings insight into the fabric of the electronics manufacturing industry through the lens of pushing technology limits and delving into the strategic expansions of Ventec Giga Solutions.

Battling Counterfeit Electronics in Manufacturing

Paul Jarski, product development manufacturing leader at Case New Holland (CNH), discusses his extensive experience with counterfeit electronics throughout his career. He highlights the challenges faced during market allocations, where counterfeit parts infiltrated supply chains and causing significant issues. Paul recounts the rigorous processes implemented to detect and prevent counterfeits, including advanced material analysis and testing. Counterfeit parts occasionally slipped through despite these measures, leading to costly and time-consuming audits and verifications to ensure product integrity and safety. 

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Fall presents us with a lot of tradeshow activity, such as the Anaheim Electronics & Manufacturing Show, which kicked off the month in California. Our intrepid managing editor Andy Shaughnessy has been on the scene and I look forward to hearing more about the show from him. Next week, we’ll be at PCB West in the Bay Area, followed by SMTAI in Chicago the following week. For me, it feels like a proper launch into standard Q4 craziness highlighted by the end-of-year sales hustle and frenetic finalization of 2025 budgets. October also brings a stark reminder that the holiday season will soon be upon us. So, let the crazy begin.

Department of Defense Awards $30 Million to Expand Domestic Printed Circuit Board and Substrate Production

The Department of Defense announced today a $30 million award to TTM Technologies Inc. (TTM) in Santa Ana, California. This award, facilitated through the Defense Production Act Purchases (DPAP) office, will enable TTM to acquire and install advanced manufacturing equipment and develop prototype designs for printed circuit boards. The project will commence at TTM's Centers of Excellence across the United States, ultimately culminating in integration into its new Syracuse, New York facility. This strategic initiative aims to enhance TTM's capabilities and enable the timely delivery of cutting-edge technology to support vital defense programs.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

If you know Dave Hoover of TTM, then I am honored to inform you that he has retired from the industry as of this week. But we can keep tabs on him through his weekly online blues radio program “Groovy Hoovy’s Different Shades of Blue Radio and Video Show.” Congratulations on your transition to “civilian” life, Dave.

Tech Trajectories: Projecting Trend Advancements

Reflecting on technological advancements and examining how foundational technology trends evolve is essential to seeing where the world and society are headed. Last year, significant strides were made in data governance, automation, edge computing, artificial intelligence (AI), and the metaverse. IEEE Standards Association (IEEE SA) is keeping its eye on what’s ahead for these technologies that are transforming various industry sectors. In this article, I’ll examine the current state of these technologies and outline the advancements and directions we expect ahead.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week in the world of PCB design and manufacturing. In this week’s roundup, there’s a little bit of everything. We have a look at PCB technology of tomorrow, an interview with an engineer who designs both PCBs and ICs, and government relations news from Washington, D.C. We also have an article on dispensing technology, and a final installment of our podcast on “designing for reality.”

IPC Releases Newest List of Standards Updates, Revisions

Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q3 2024.

From Silicon to Systems

For the past few years, IPC has been championing the term “silicon to systems.” More than a buzzword, it has become a slogan—and even a kind of roadmap—for the organization. The term comes in especially handy when IPC is advocating for this industry in Washington, D.C., often addressing politicians who have little understanding of electronics technology.

Audits: A Critical Element of Process Control

A formal audit always seems difficult to justify. Companies do not want the expense, and employees do not want the hassle. There is always a chance of failure, and management struggles to understand the benefits. If you or your company has had issues with auditing, hopefully, this article will help you feel a little more comfortable about the auditing process.

In Honor of the U.S. Labor Day

Sept. 2, is Labor Day in the United States, always observed the first Monday in September. In its official declaration, we learn that “Labor Day is an annual celebration of the social and economic achievements of American workers. The holiday is rooted in the late 19th century when labor activists pushed for a federal holiday to recognize the many contributions workers have made to America’s strength, prosperity, and well-being.”

Asymmetric Hybrid Printed Circuit Board Design: Warpage Considerations

The printed circuit board (PCB) accounts for a significant portion of the PCBA’s (printed circuit board assembly) BOM (bill of material) cost. Designs with hybrid PCB stackup are adopted to reduce the cost of the PCB by using less expensive laminate materials in layers that do not have routings for high-speed signals (e.g., power and ground layers). The conventional hybrid PCB stackup design is symmetrical in the middle. This engineering technique has been employed in the data center industry for quite some time. To extend the idea and optimize the purpose of hybrid PCB stackup design, the feasibility of an asymmetric hybrid stackup is currently being studied.

Give Yourself an Edge at the IPC High Reliability Forum 2024

For those who support military and defense products, few topics are more important than reliability, particularly as we venture into complex packaging requirements that accommodate next-gen chips and electronic systems. Recently, I visited with Teresa Rowe, IPC senior director, assembly and standards technology, to discuss the IPC High Reliability Forum (HRF), Oct. 9-10, at the McKimmon Center, in Raleigh, North Carolina. With topics that cover high-voltage electronics, standardized test methods, and assembly and solder joint X-ray challenges, it is clear that this event needs to be included on your annual conference calendar.

A Less Expensive Defense and Aerospace PCB Fab Startup

Editor’s note: Investing in a new printed circuit board fabrication startup is not for the faint of heart or the light of wallet. Standing up a new “high-tech” PCB fab facility capable of becoming qualified for aerospace and defense work typically takes a minimum investment of $50 million. However, Alex Stepinski says entering the defense and aerospace markets with a new PCB fabrication start-up facility far under this prohibitive cost benchmark is possible when good partnerships, innovation, and sound engineering design enter from the beginning. In this article, Alex Stepinski outlines just how this can be achieved.

UHDI Fundamentals: UHDI Applications for Aerospace

Ultra high density interconnect (UHDI) technology refers to advanced manufacturing processes used to create extremely compact and highly efficient electronic circuits at the sub-1-mil line and space level. In aerospace applications, UHDI is crucial due to the stringent requirements for weight, reliability, and performance in a challenging environment.

Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle

Current trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.

BPMI Inc. Uses IPC Standards to Support the U.S. Nuclear-powered Naval Fleet

Our IPC member profile focuses on Bechtel Plant Machinery Inc (BPMI), responsible for the fabrication, test, delivery, installation, and field support of high-quality nuclear power plant components for installation in submarines and aircraft carriers.

UHDI Fundamentals: UHDI for RF Microwave Applications

Ultra high-density interconnect (UHDI) technology has significant potential for RF (radio frequency) microwave applications. Its advantages lie in its ability to provide high-density routing and integration, which are crucial for complex RF circuits. Here are three key UHDI benefits in RF microwave applications:

Counterfeit Detection Course: It’s the Real Deal

Anthony (Tony) Bryant is a trained expert in component counterfeiting techniques who has been collaborating with IPC on a new intermediate-level course on counterfeits. Tony is in final preparation to launch this course and shared his reasons for the course, as well as information about its content and value to EMS companies.

The Value Side of Training, Part 1: Five Easy Ways to Measure the ROI on Training

The best thing about a good investment is the yield it provides. This series of articles on the value side of training will focus on how to effectively measure the return on your investment (ROI) when training your staff. I will offer practical, quantifiable metrics you can apply today. Think of it as a quick checklist for every effective training program.

Pushing the Limits of PCB Impedance Control

All PCB fabricators have their own carefully guarded methods of modifying their process to achieve the desired controlled impedance specification. When you start considering the techniques and processes in PCB manufacturing, the list seems endless: etching, high layer counts, feature density, pressing, layer registration, material storage, and expansion/contraction. With so many contributing factors, who can blame them for playing their cards close to the vest?

Shane Whiteside Appointed as New PCBAA Chair

Summit Interconnect President and CEO Shane Whiteside was recently appointed as chair of the Printed Circuit Board Association of America (PCBAA), replacing Travis Kelly, CEO of Isola Group. Shane’s distinguished career in PCB manufacturing and leadership spans several decades, so this new role lends itself well to PCBAA’s mission as an important advocacy vehicle for the PCB industry.

Beyond Prepreg: The Glassless ‘Revolution’

As our industry rallies around the call to action for HDI and UHDI, we find unparalleled and myriad laminate options. This abundance is rivaled only by the question surrounding them: Can they measure up to the high technology packaging demands required in our near future? Unsurprisingly, recent developments in FR-4-esque materials for high-speed and high-density designs, as well as newer, glassless technology for replacing traditional glass-impregnated laminates and prepreg, are garnering much interest. I caught up with Alun Morgan, technology ambassador for Ventec International Group, to ask about the impending “glassless revolution” and how it’s poised to solve some of our manufacturing challenges.

USPAE’s Jim Will on PCBMC, Defense Needs, and Onshoring

Jim Will has assumed the role of executive director of the U.S. Partnership for Assured Electronics (USPAE). In his first interview with I-Connect007, Jim discusses his background in the commercial and defense industries, emphasizing U.S. defense assured electronics needs. His passion shows through as he discusses USPAE initiatives and looks forward to finding ways for partner organizations to work more closely together.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week 

He’s back, and in splendid form. Pete’s Starkey’s coverage of the EIPC Summer Conference, which took place June 4-5 at the European Space Centre, The Netherlands, is top notch. Joan Tourné from NextGIn Technologies emphasized that our attention must be focused on the interconnection ability of our PCBs and highlights VeCS as an alternative to the traditional plated-through-hole approach. Finally, Martyn Cauwe of IMEC discusses environmental impact and specifically, the need for a better, parametric approach to quantifying it, something European businesses are being required to do on the regular.

IPC Impact Day Recap With Rich Cappetto

IPC has hosted its annual IPC Impact Day in Washington, D.C., for at least the past decade, with the first event taking place in the 1990s. This popular and important advocacy tool allows an industry segment to meet their local congresspeople, educate them on important issues, and influence new or existing legislation to support their interests. We spoke with Rich Cappetto, senior director of North American government relations at IPC, about the importance of the event and what it means for the greater PCB industry. He also highlighted an important change: There will be several IPC Impact Days throughout the year to allow smaller groups of industry professionals to visit Washington more often with a more targeted message.

Off Like a Rocket: A Review of the EIPC Summer Conference, Part 1

Motorway traffic jams, airport car parking, walking for miles, queuing for security, delayed flights—oh, the joys of travelling. I was quickly reminded of my status as a foreigner while waiting patiently in line for a half-hour at passport control to enter the European Union at Amsterdam Schiphol, having flown all the way from London Luton in the United Kingdom, that great distance of 200 miles. 

An IPC ‘Blockbuster’: IPC-7711/21

Dan Foster, Missile Defense Agency, has been instrumental in developing IPC-7711/21, Rework, Modification and Repair of Electronics Assemblies, over several revisions of this important guideline document. We talked to Dan and committee member Agnieszka Ozarowski, BAE Systems, about the most recent revision.

Governments Struggling With ‘Silicon-to-Systems Approach’

What do you do when you don’t know what to do? That is the conundrum facing U.S. government officials overseeing billions of dollars in strategic investments in the domestic microelectronics industry. Enormous grants are beginning to flow to the chips sector, and after years of IPC advocacy and education efforts, policymakers have gained a clearer picture of the rest of the electronics supply chain, including everything chips depend on to function.

Advancing PCB Technology: A Conversation With John Johnson

John Johnson, an industry veteran with 45 years of experience, shares insights on the adoption of the Averatek process at American Standard Circuits, highlights the shift toward finer lines and spaces in PCB manufacturing, and emphasizes the importance of technology, cleanliness, and material adhesion in achieving ultra-fine lines. He addresses the challenges in advancements of the additive process, emphasizing the need for a mindset shift and employee training.

The Sky's the Limit: A Day in the Life of PCB Designer Paul Brionez

Paul Brionez is a senior printed circuit board layout engineer for Wisk Aero LLC. He’s responsible for the layout of PCBs and the management of library parts being created to use in PCB assemblies. He’s also involved in the creation of processes and procedures to be used in the creation, management, and release/revision of PCBs and PCBAs used for Wisk Aero applications.

Chiplet Architecture for AI Will Create New Demands for Assembly

As we look deeper into the entire AI ecosystem, it becomes clear that AI algorithms are intensely hungry for compute power. This demand for compute resources is accelerating beyond the customary rate predicted by Moore’s Law, just as traditional semiconductor fabrication methods are failing to maintain Moore’s Law. It’s a real dilemma.

Listen to I-Connect007’s Latest Podcast Episode: Empowering Electrical Engineers

I-Connect007 is thrilled to announce the release of the latest episode in Series 3 of its popular podcast, On the Line With... , available now on Apple and Spotify.

Advocacy: There’s No Time to Waste

In the late 1990s, I worked for a PCB company ardently working to build manufacturing presences in Malaysia, Taiwan, and eventually China’s mainland. For some of us who had the resources, we followed our OEM customers offshore as they began demanding increasingly greater price concessions from their stateside suppliers. The government was not coming to the rescue of the PCB manufacturer, so we rode the changing economic tide as it turned unwaveringly toward globalism and cheaper labor.

Real Time with… IPC APEX EXPO 2024: Summit Interconnect: Ready for Challenges of Today and Tomorrow

Guest Editor Gabriel Zepeda and John Vaughan, VP of strategic markets for Summit Interconnect, highlight the challenges in the PCB sector, such as the dwindling number of fabricators and the trend towards miniaturization. As John points out, Summit was a founding member of the Printed Circuit Board Association of America, which has grown to 50 member and aims to educate legislators, while funding opportunities support chip operations.

Listen Up: Popular Podcast Series Returns With Discussion of Electroless Copper

In the latest episode of the podcast series, On the Line With: Designing for Reality, Nolan Johnson returns to Sunstone Circuits in Mulino, OR, to continue down the manufacturing process with Matt Stevenson.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.

USPAE to Springboard U.S. Technology Forward

The U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.

Real Time with… IPC APEX EXPO 2024: Insight into Summit Interconnect's Success

Shane Whiteside, CEO of Summit Interconnect, discusses the company's recent recognition as one of the best PCB fabricators in the industry by receiving IPC's Peter Sarmanian award. Whiteside touches on the impact of changes in the marketplace, such as the Defense Production Act and presidential determination, on their growth. Whiteside also shares the company's focus on mechanical and data automation to enhance manufacturing processes and anticipates more automation and evolution in the industry.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In this week’s roundup, we have a variety of articles covering everything from design through assembly, and even box build. I’ve always wondered whether box build was all it was cracked up to be. Do customers really pick one EMS provider over another because one company offers box build? And if you’ve ever wanted to volunteer, IPC’s Thought Leaders Program is looking for a few good technologists to help them on their mission. Check out Stanton Rak’s article, which was published in the spring issue of IPC Community.

Big Win for Defense Production Act Budget Allocation in FY24 Budget

One year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.

Growth Potential: Electronics Manufacturing Driving Massive Surge in Manufacturing Investment

In the early months of the pandemic, investment in manufacturing infrastructure, such as plants and production facilities, declined sharply. Real investment dropped over 11%, before finally recovering to pre-pandemic levels in the first half of 2022. Over the past two years, however, several factors have combined to drive manufacturing investment to record levels.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

For my must-read picks of the week, I’m highlighting Parker Capers, a young professional seeking employment, solid counsel from Dan Beaulieu on what your post-show plan should look like, more information and insight on “chiplets” and the need for secure data transfer standards from columnist Preeya Kuray, as well as Matt Stevenson’s design for reality wisdom. It’s a reminder to download one of our newest books (there are several) you don't want to miss if you are an assembler.

Real Time with... IPC APEX EXPO 2024: An Introduction to Mastering IPC Certifications With Blackfox

Darin Pesola, master instructor for IPC certifications and sales manager at Blackfox, discusses the development of training materials for their training centers and online courses. Darin also emphasizes the challenging space addendum training course, which involves meticulous tasks and takes a week to complete. Upon finishing, students can demonstrate their acquired skills and move into the workforce.

Real Time with... IPC APEX EXPO 2024: IPC Government Relations Holds Lawmakers Accountable

The IPC Government Relations team is constantly educating Congress and the executive branch about the importance of a robust domestic electronics manufacturing industry. As Richard Cappetto explains, the GR team is focused on proactive strategies, workforce policies, and sustainability, as well as the significance of apprenticeship programs, President Biden's executive order, and employer incentives. Also discussed is the PCB Act, its investment program, tax incentive, and DoD's understanding of supply chain risk.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

As we publish this week’s most-read news, the I-Connect007 team is wending its way home from an eventful and productive week at IPC APEX EXPO in Anaheim, California. We’ve posted a variety of dispatches from the show this week, released 73 realtimewith.com video interviews (and counting), and also gathered the content and updates you’ll be looking for in the upcoming issue of Show & Tell… IPC APEX EXPO 2024.

The Impact of U.S. Defense Production Act on PCB Industry

This interview with David Schild, executive director of PCBAA, covers the recent passage of the Defense Production Act and its impact on the printed circuit board industry. It highlights the importance of funding, domestic production, and government support for the industry's growth. He mentions proposed legislation like the Protecting Circuit Boards and Substrates Act and the need for a strategic approach to national security and supply chain resilience.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We are well into trade show season and what a season it has been so far! SMTA Dallas, IMAPS, and the SMTA UHDI Symposium have filled out the past two weeks as we barrel toward IPC APEX EXPO in just a week’s time. There have been many exciting announcements of equipment and technology that will be showcased at IPC APEX EXPO, including announcements from Ventec, Blackfox, Insulectro, Indium, and more. Click through the news to see what’s in store for the big show.

SMTA Conducts First UHDI Symposium

SMTA’s first UHDI Symposium in Peoria, Arizona, on Tuesday, March 26 featured a standout full-day technical program with 11 separate presentations on what will be required for our companies to move to ultra HDI manufacturing. The event was the brainchild of Tara Dunn, SMTA director of training and education. It included a compelling and collaborative presentation by David Haboud of Altium, John Johnson of American Standards Circuits, and Chrys Shea of Shea Engineering, who had spent the past several weeks creating and building an appropriate SMT test board vehicle for UHDI, something that was passed around for all conference goers to see and touch.

Blackfox Ready for IPC APEX EXPO 2024

Blackfox Training Institute offers IPC-certified training for a myriad of PCB assembly techniques and standard certifications. With many technologists beginning to eye retirement, this training is at a premium. I recently spoke with Jamie Noland, director of training and education for Blackfox, about the company’s latest educational efforts, and his plans for the upcoming IPC APEX EXPO, where Blackfox will be exhibiting.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week's news feed contains a bunch of big money items, as well as some interesting industrial and technology puzzles to be solved. There’s even some down-home people news from the Dallas SMTA conference held this week. Don’t overlook the latest issue of PCB007 Magazine, either. The topic is sustainability, which is becoming an ecosystem of its own.

CACI Secures $239 Million Task Order for U.S. Army Unified Network Modernization

CACI International Inc announced that it has secured a single-award technology task order worth up to $239 million with a one-year base period and four one-year option periods to modernize the U.S. Army’s Global Secret Internet Protocol Router (SIPR) network (GSN), including the application of commercial solutions for classified (CSfC) technology to increase options for secure user access and mobility.

Real Progress Toward Solving U.S. Workforce Problems

IPC achieved a landmark in 2023 by creating an apprenticeship program approved by the U.S. Department of Labor. With such a registered framework in place, industry can work through IPC to secure local, state, and federal dollars for workforce development in a way they’ve never been able to do before. Cory Blaylock, director of workforce partnerships at IPC, has been instrumental in developing and moving this program toward adoption, and outlines what companies need to know to get involved.

BOSTONtec Shares Perspective on Today's Wire Harness Industry

BOSTONtec is a Michigan-based company established in 1993 that produces high-quality, height-adjustable modular workstations. It serves the assembly, fulfillment, medical, automotive, aerospace, and technology markets. We visited with Rob Doucette, senior applications engineer, to learn more about the wire harness industry from his point of view.

Reassessing Surface Finish Performance for Next-gen Technology, Part 2

The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.

John Mitchell Addresses Industry Workforce Challenges with U.S. Department of Commerce

IPC’s efforts in government relations and advocacy have been pivotal in getting legislation like the CHIPS Act passed. In February, IPC President and CEO Dr. John W. Mitchell was back in Washington, D.C., representing our industry in a meeting convened by the U.S. Department of Commerce, where he discussed workforce issues in our industry and how to ensure that our businesses have the workforce they need. In this audio interview, he reviews his concerns and solutions on workforce development.

DARPA’s REMA Program to Add Mission Autonomy to Commercial Drones

Commercial drone technology is advancing rapidly, providing cost-effective and robust capabilities for a variety of civil and military missions. DARPA’s Rapid Experimental Missionized Autonomy (REMA) program aims to enable a drone to autonomously continue its predefined mission when connection to the operator is lost.

A System Designer’s Dream World at DuPont

DesignCon 2024 was held January 30–February 1 in Silicon Valley, and Design007 Editor Andy Shaughnessy and I were there to experience this important show for PCB and system designers. We are always on the lookout for gems that showcase innovation and cutting-edge technology. Such an opportunity arose through a private tour at DuPont’s Silicon Valley Technology Center in Sunnyvale.
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