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Boeing, Shield AI Set to Collaborate on Artificial Intelligence, Autonomy for Defense Programs

Boeing and Shield AI have signed a memorandum of understanding to explore strategic collaboration in the areas of autonomous capabilities and artificial intelligence on current and future defense programs. Shield AI created Hivemind, an artificial intelligence pilot that has flown a variety of aircraft. According to Shield AI, the AI pilot can also enable swarms of drones and aircraft to operate autonomously without GPS, communications or a human pilot in the cockpit.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I try to not talk about the weather in this space, but this week I feel compelled. I’m based in the Pacific Northwest, and we’re relatively used to it being wet and rainy. But just south of us in California, the state has gone from what I read has been called the driest period in the West in the past 1,200 years to a right proper drenching. This week’s news cycle felt like one of those California-style “atmospheric rivers.” There was so much worthy reporting worthy that I was a bit overwhelmed in making my final selections. Suffice it to say that, this week, there is quite a bit of news that’s worth your time to read.

Curtis Grosskopf: Lasting Connections Fuel Progress

Dieter Bergman IPC Fellowship Award winner Curtis Grosskopf, a senior engineer at IBM, reflects on the evolution of IPC committees and the vital importance of their work, especially in collaboratively creating industry-wide standards to guide the work of professionals in every sector. This commitment to multidisciplinary cooperation is a mindset that should be fostered at the start of every career.

Are You Offering Options in Your Bill of Materials?

In this interview, Saline Lectronics (an Emerald EMS company) President Jason Sciberras talks about PCB designers offering packaging options in the bill of materials. As Jason explains, mil/aero manufacturers like Saline can’t make many changes to a design without getting recertified, so including approved packaging options in the BOM from the start is a great way to go. Are you offering options in your BOM?

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week in our industry. We have a duke’s mixture of news and columns in this week’s Editor’s Choice, starting off with some good news for the American electronics manufacturing industry. In his State of the Union speech, President Biden signaled his support for the CHIPS Act and the U.S. electronics industry, and he promised that Washington would put its money where its mouth is this time. Is it going to happen? Don’t bet the rent money.

Time to ‘Finish the Job’ on PCB Funding

In his State of the Union address in early February, President Biden departed from his usual topics about education and the economy to mention the new CHIPS Act, as well as supply chain and infrastructure issues. For perspective on those remarks, Nolan Johnson chats with David Schild, executive director of the Printed Circuit Board Association of America (PCBAA).

EIPC Winter Conference 2023: Day 1 Review

The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.

Real Time with... IPC APEX EXPO 2023: Taking Our Message to Washington

Nolan Johnson talks with Chris Mitchell, vice president of Global Government Relations at IPC, about key issues IPC is working on today and how you can be involved in advocating for our industry in 2023. Their conversation also covers the CHIPS Act, advanced packaging, and much more.

A Conversation With ‘The Space Gal’

With multiple advanced degrees in aerospace science, Emily Calandrelli could have had her pick of any project in earth and space science. Instead, she has chosen to use her skills in science policy and communication to break down complex science topics, advocate for women in STEM fields, and bolster enthusiasm for the next generation of scientists through her own Netflix show and an active slate of social media accounts. Emily’s platform is huge, but it's one that she wholeheartedly embraces. In this interview with the I-Connect007 Editorial Team, Emily talks about her unconventional entry into science, what’s ahead for space commerce, advice for industry leaders, and what she really thinks about going into space.

Real Time with... IPC APEX EXPO 2023: The Mission of USPAE

Nolan Johnson sits down with Chris Peters, executive director of USPAE, to hear an update on the organization, including a new UHDI-capable cooperative production facility.

Printed Circuit Boards Have Champions on Capitol Hill

House Resolution 7677 from the 2021/22 Congressional session may have run out of time before the election cycle, but that hasn’t ended the effort to help fund the printed circuit board industry alongside the semiconductor industry. IPC vice president of global government relations, Chris Mitchell, shared this letter, sent to DOD on Wednesday by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), which insists DOD must “leverage all available resources, including the use of Title III of the Defense Production Act (DPA), to increase domestic production of PCBs and IC substrates.”

Real Time with... IPC APEX EXPO 2023: PCBAA Legislative Update

PCBAA Chairman Travis Kelly and Editor Nolan Johnson discuss the association’s activities, including legislation in the range of $3 to $5 billion that follows the CHIPS Act, and why Congress needs to support the PCB industry as they did the semiconductor segment.

Real Time with... IPC APEX EXPO 2023: Challenges of New Product Development

John Ekis, market segment director, Aerospace and Defense, Rogers Corporation, discusses with Pete Starkey the importance of close applications engineering relationships in understanding and responding to the requirements and challenges of specialist new product development.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We have new projects in the U.S. Army space programs, research on gold thickness and solderability, a call for papers throughout 2023 from SMTA, an investment in Korean facilities by ASM, and an adjustment in TTM’s assignation with the U.S. DoD. All together, these five must-reads represent the hurtling trajectory that R&D seems to be following in 2023.

TTM Technologies Reports Fiscal Q4, 2022 Results

TTM Technologies, Inc., a leading global manufacturer of technology solutions including engineered systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and printed circuit boards (PCB), reported results for the fourth quarter and fiscal 2022, which ended on January 2, 2023.

Real Time with... IPC APEX EXPO 2023: EMS Leadership Discussion

Guest editor Geoff Leeds meets with John Vaughan of Summit Interconnect to discuss his participation representing the PCB industry on the supply chain panel at the EMS Leadership Summit and the DoD roundtable, as well as trends he’s seeing in those market segments.

I-Connect007 Editor’s Choice: Five Must-Reads For the Week

It’s Feb. 3, 2023—2/3/23—and now we know the results of yesterday’s Groundhog weather forecast straight from Gobbler’s Knob in Pennsylvania. Punxsutawney Phil says six more weeks of winter. If you’re watching the ongoing ice storms blanketing much of the United States at present, that seems like a safe bet. Also a safe bet is that the most-read news this week is IPC APEX EXPO related. Additionally, this week IPC published its EMS and PCB numbers for December. All told, lots of industry news to read this week.

DARPA Collaborates with Commercial Partners to Accelerate Quantum Computing

DARPA has selected three industry corporations for the Underexplored Systems for Utility-Scale Quantum Computing (US2QC) program. US2QC seeks to determine whether an underexplored approach to quantum computing is capable of achieving utility-scale operation – meaning its computational value exceeds its cost – much faster than conventional predictions.

Don't Blink: The IPC APEX EXPO Time-lapse

It’s a tradition here at I-Connect007 to set up a time-lapse for IPC APEX EXPO. There’s something satisfying, mesmerizing even, to watch the show floor build out and see the moment when the doors open and visitors fill the exhibit hall. Based on what others have said over the years, I know I’m not the only one whose favorite part is when the carpet gets rolled out and the whole character of the exhibition changes. This time lapse starts on the Saturday prior and continues through the Thursday tear-down phase.

A Challenge Facing Aerospace Designers In 2023

As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.

It’s Here: The Launch of IPC Community Magazine

IPC Community Magazine launches today at IPC APEX EXPO 2023, both in digital and print form. It is now widely available for download at no cost. This magazine helps tell the stories of IPC, particularly for IPC members who use and interact with the trade organization. IPC worked closely with I-Connect007 (IPC Publishing Group) to develop the concept for the publication, and asked John W. Mitchell, president and CEO of IPC, to share a few thoughts as he looked at the magazine for the first time in print.

Durability and Cost Benefits Drive Mil-Aero Demand for OCPP

Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).

US, Japan Sign Space Collaboration Agreement at NASA Headquarters

During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The youngsters are back in school, and we’re all back to work. The water is back on for most of us in Atlanta; when temps dropped down to 8 degrees Fahrenheit, our pipes started bursting left and right. After a Christmas dinner with no water, I have a new appreciation for H2O. It’s been a busy week, and we published a variety of articles, columns, and news items. In this week’s top five, we have news about the market in Southeast Asia, a look at what the CHIPS Act really entails, a deep dive into CMMC, and a peek at how printed electronics developers are using flexible circuit concepts to facilitate PEC. We also say goodbye to a Top Gun PCB designer who left us way too soon.

Ventec: Contextualizing the CHIPS Act

Nolan Johnson hears from Alun Morgan, Technology Ambassador at Ventec, and Mark Goodwin, Ventec’s COO, about the benefits and risks posed by new PCB-oriented legislation in the U.S. and Europe. Faced with a rapidly consolidating industry, especially in the face of mounting pressure from the Russia-fueled energy crisis, government intervention is a welcome prospect—as long as legislators are committed to addressing the full scope of the issue, including the supply chain’s migration to Asia. Ventec is hopeful that, having been called on to educate government officials on the challenges facing the industry, they will help spur future legislative changes that will protect and grow the industry’s interests.

Designing a Sustainable Future

While it may be traditionally considered a PCB fab and assembly show, IPC APEX EXPO is quickly becoming a destination for PCB designers and design engineers. Flipping through this year’s schedule, I counted 15 Professional Development and Technical Conference classes that focus on PCB design, as well as several fabrication classes that many of you should probably take. I checked in with Carlos Plaza, IPC’s senior director of educational development, to discuss the organization’s drive to present more PCB design curriculum at the upcoming show and how the show can give designers the tools they need to overcome the many challenges currently facing the industry.

Essemtec: Manufacturing Moves In-house

Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.

ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event

Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme. Guest speakers highlighted new technology in selective solder nozzles, flexible circuits, industry cooperation, and a greener future by recycling PCBs.

NASA’s Artemis I Mission Sees Successful Completion

NASA’s Artemis I mission came to a successful conclusion with the splashdown and recovery of the Orion spacecraft. This mission was an uncrewed, integrated flight test of the hardware and technology that will take humans back to the Moon for the first time in more than five decades.

Polar Instruments: Simulating PCB Potentialities

Nolan Johnson checks in with Polar’s Martyn Gaudion on the evolving needs of global PCB manufacturing markets in a post-pandemic world, where generating accurate PCB specification documentation is essential to successfully navigating today's rampant supply chain constraints. Polar has positioned itself to meet these needs through agile software product developments that allow OEMs and fabricators to simulate material interactions and end-product specifications, including in-demand features like a comprehensive "structure view" that allows users to visualize all the transmission lines on a given a PCB. Though keeping pace with the demands of a rapidly growing industry has been challenging, Polar's commitment to innovation has kept its software suite ahead of the curve.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.

An Opportunity to Give Thanks

I-Connect007 wants to take this opportunity to give thanks to so many people that make "the magic" happen day in and day out. Thanksgiving is a time, of course, to give thanks for the bounty that we enjoy, and that couldn't be truer each day for the support we receive in editorial, advertising, and marketing of our daily, weekly, and monthly publications. It's a pleasure to contribute to the industry—and to receive contributions. Read our Thanksgiving message and then enjoy your turkey day.

Northrop Grumman to Enhance UH-60V Aircraft Capabilities

Northrop Grumman Corporation has been selected to provide engineering services for the KBR-led $156.7 million, five-year Department of Defense Information Analysis Center’s (DoD IAC) multiple-award contract (MAC) vehicle.

ICAPE USA's Jeremy Griner Talks Market Conditions

ICAPE USA managing director Jeremy Griner discusses current market conditions for PCB fabrication and shares the ICAPE perspective on which industries are experiencing growth. Griner also outlines how ICAPE is navigating current shipping and logistics challenges while continuing to grow sales during these dynamic times.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.

PCB Carolina Breaks Attendance Record

PCB Carolina has been growing consistently for the past decade, and this year the show reached a milestone: more than 1,000 attendees. Yesterday, the show was the busiest I’ve ever seen it; I almost had to park off the NC State University campus. Fortunately, I’m an expert at “the parking lot game.” I waited until a guy was leaving and then I sniped his spot. Bam!

IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023

IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.

NASA Continues Psyche Asteroid Mission

Earlier this year, Psyche missed its planned 2022 launch period as a result of mission development problems, leading to an internal review of whether the mission would be able to overcome these issues to successfully launch in 2023.

EIPC Technical Snapshot: ‘Tremendous Uncertainty’ in Global PCB Marketplace

For the past two years, EIPC’s Technical Snapshot series has kept us extremely well-informed on developments in printed circuit materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? The 19th chapter (coincidentally on Oct. 19) in the series gave us a privileged opportunity to find out, as two leading industry analysts presented their observations and opinions in a webinar introduced and moderated by EIPC technical director Tarja Rapala-Virtanen.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation! This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about?

EMA Helps Ease Designers’ Supply Chain Woes

Supply chain issues are continuing to cause disruptions in our industry, though lead times have dropped from astronomical to merely troublesome. In this interview, Chris Banton, EMA Design Automation’s director of marketing, explains how Cadence’s software has evolved as designers’ needs have changed in the past few turbulent years, including providing designers with component availability data early in the process.

Sunstone and I-007eBooks Launch Book on Designing for Reality

I-007eBooks is excited to announce the release of the latest title in its series for designers, The Printed Circuit Designer’s Guide to… Designing for Reality. This book covers both written and unwritten rules for how to create a realistic, manufacturable design.

PCB Legislative Update: HR 7677

Electronic industry association leaders like IPC, PCBAA, and USPAE have been trekking to Capitol Hill almost weekly this year to reinforce the dire state of the industry and seek additional co-sponsors for HR 7677, a bill supporting the American printed circuit board industry. However, with only 78 days until the end of the 117th Congress, it is not likely that anything will move by the end of this session.

IPC Advanced Packaging Symposium: An Urgent Need to Support Global Efforts

After two days of presentations, panel discussions, and impromptu hallway conversation at the IPC Advanced Packaging Symposium, one thing became clear: There is an urgency to support advanced packaging in all regions across the globe. The symposium, Oct. 11-12 in Washington, D.C., concluded with what seemed to be a great deal of expanded perspective for those who attended.

Intel Joins DARPA’s Space-BACN to Accelerate Inter-Satellite Communications

The U.S. Defense Advanced Research Projects Agency (DARPA) has selected Intel for Phase 1 of the Space-Based Adaptive Communications Node (Space-BACN) program, which aims to create a low-cost, reconfigurable optical communications terminal that will translate information between diverse satellite constellations.

IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs

There is a significant capability gap in advanced substrate packaging in North America, forcing all semiconductors to be packaged in Asia and leaving North America at risk in its supply chain. This was a common theme during a two-day IPC Advanced Packaging Symposium, which launched yesterday at the Kimpton Monaco hotel in Washington, D.C.

Viasat, Inmarsat Confident their Combination Benefits Consumers

Viasat Inc. and Inmarsat remain committed to working with the UK’s Competition and Markets Authority (CMA) to demonstrate how their planned transaction will benefit airline, passenger, and enterprise users of In-Flight Connectivity (IFC) in aviation businesses.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, our five must-reads include the IPC report on the EMS industry and a report on ICs for the automotive market. Add to that Lockheed’s highest powered DoD laser yet, IPC’s APEX keynote announcement, and—for you conference and expo junkies—a calendar of upcoming industry events. I can’t help but notice that much of our news is about, well, something new. In this case, my editor’s picks for the week capture new technology, new perspectives, new ways to communicate content, and new developments that we can expect to see in our future daily life. To borrow a phrase from the TV show “Firefly,” everything is “shiny” this week. I will be at PCB West, the IPC Advanced Packaging symposium, SMTA International, and electronica. If you see me, say hello, and share something cool about the part of the industry you’re in.

Michael Carano: A Focus on Process Control, Part 2

In this second half of our conversation, Michael Carano discusses some of the metrics that fabricators need to consider before investing in new processes, especially process control technologies, and some of the challenges board shops face updating brownfield sites.

The New World Order of JIC

The great business thought leader Margaret Heffernan commented that we are changing from just-in-time (JIT) to just-in-case (JIC). As we’ve worked our way through the issues of the past two years, the world is changing from a complicated to a complex system, and we must be prepared to face the challenges it brings. To survive today, we need the JIC mentality. We must be prepared for the unexpected. No longer can we rely on cycles and patterns to predict the future, or what we might be able to handle based on what that future brings. Now we must prepare for the unexpected. We must be flexible and able to adapt to whatever comes our way.

A Focus on Process Control, Part 1

Michael Carano is a noted subject matter expert with respect to process control, electroplating and metallization technology, surface finishing, and reliability. So, it was only natural that we sat down to talk about mechanizing an existing facility given today’s fickle environment. Will any of the CHIPS funding trickle down to bare board fabrication? What process can be adjusted on the factory floor? The focus needs to be more than just on manufacturing and getting work out the door, he says, but also process control.

Designing Through Supply Chain Pain

Engineers are accustomed to the demanding challenges of designing for miniaturization, cost reduction, cross platform compatibility, and harsh environments. What has proven to be the most painful experience of my career (and for many of my colleagues) is the sheer lack of components from which to build our designs. Development cycles—commercial, industrial, medical, avionics—have been severely impacted, from large enterprise corporations to small design/integration companies. Awareness of the situation is the first step to understanding the underlying problems faced by today’s design engineers industry wide. Here are a few of the situations I have faced in the last year alone.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai! But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?

Will Marsh: CHIPS Act Update

Now that the CHIPS Act has become law, Nolan Johnson reconnects with PCBAA President Will Marsh to ask the question: What now? Will brings Nolan up to speed on the initial stages of implementation and administration, and provides more insight on the Supporting American Printed Circuit Boards Act of 2022.

A Deeper Look at the CHIPS Act Investment

In this interview with Chris Peters at U.S. Partnership for Assured Electronics (USPAE), Nolan Johnson seeks for better understanding regarding the implications of funding the CHIPS Act. Frankly, where and how will the $52 billion be spent? Who will decide how the funds are allocated? And surprisingly, who will benefit the most from this boost into the microelectronics industry?

What’s Going On in Congress? Your Handy Guide to PCB Legislation Headlines

We know you have so many questions about what the legislation means for you. Will there be funds to expand or upgrade my facilities? What about tax breaks? How will my specific needs be known? What will the current legislation mean for U.S. vs. China relations? Use this handy guide to get caught up, sort out the CHIPS from the USICAs, and be that someone who talks knowledgably at dinner parties.

IPC Advanced Packaging Symposium to Draw Industry, Government Representatives

Nolan Johnson speaks with IPC’s Chris Mitchell, vice president of global government relations, and Matt Kelly, chief technologist, about the inaugural IPC Advanced Packaging Symposium, scheduled for October 11-12, 2022 in Washington, DC. In this conversation, Mitchell and Kelly detail the symposium's objectives, presenters, and the value to both fabricators and assemblers in attending.

NASA Awards Next-Generation Spaceflight Computing Processor Contract

NASA’s Jet Propulsion Laboratory in Southern California has selected Microchip Technology Inc. of Chandler, Arizona, to develop a High-Performance Spaceflight Computing (HPSC)?processor that will provide at least 100 times the computational capacity of current spaceflight computers.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

There was some good news this week, as Republicans and Democrats managed to cooperate long enough to pass the CHIPS Act. Members of the House and Senate don’t usually act until they get worried about being voted out of office, so pardon me if I’m not ready to sing “Happy Days Are Here Again” just yet. But this is still really good news; the politicians are on the record now, and we can hold them accountable.

Excerpt Chapter 5: 'The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2'

Chapter 5 of the 2nd Volume from The Printed Circuit Designer's Guide to... Thermal Managment with Insulated Metal Substrates provides examples of thermally enhanced prepregs and cores now available in the market with the versatility to solve a wide variety of challenges. Included in this chapter you will find examples of simple designs and more complex hybrid assemblies that combine multilayer and single-layer areas on the same board.
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