American Made Advocacy: Taking the Fight to Capitol Hill
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
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Designing a Sustainable Future
While it may be traditionally considered a PCB fab and assembly show, IPC APEX EXPO is quickly becoming a destination for PCB designers and design engineers. Flipping through this year’s schedule, I counted 15 Professional Development and Technical Conference classes that focus on PCB design, as well as several fabrication classes that many of you should probably take. I checked in with Carlos Plaza, IPC’s senior director of educational development, to discuss the organization’s drive to present more PCB design curriculum at the upcoming show and how the show can give designers the tools they need to overcome the many challenges currently facing the industry.
Essemtec: Manufacturing Moves In-house
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.
ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event
Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme. Guest speakers highlighted new technology in selective solder nozzles, flexible circuits, industry cooperation, and a greener future by recycling PCBs.
NASA’s Artemis I Mission Sees Successful Completion
NASA’s Artemis I mission came to a successful conclusion with the splashdown and recovery of the Orion spacecraft. This mission was an uncrewed, integrated flight test of the hardware and technology that will take humans back to the Moon for the first time in more than five decades.
Polar Instruments: Simulating PCB Potentialities
Nolan Johnson checks in with Polar’s Martyn Gaudion on the evolving needs of global PCB manufacturing markets in a post-pandemic world, where generating accurate PCB specification documentation is essential to successfully navigating today's rampant supply chain constraints. Polar has positioned itself to meet these needs through agile software product developments that allow OEMs and fabricators to simulate material interactions and end-product specifications, including in-demand features like a comprehensive "structure view" that allows users to visualize all the transmission lines on a given a PCB. Though keeping pace with the demands of a rapidly growing industry has been challenging, Polar's commitment to innovation has kept its software suite ahead of the curve.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.
An Opportunity to Give Thanks
I-Connect007 wants to take this opportunity to give thanks to so many people that make "the magic" happen day in and day out. Thanksgiving is a time, of course, to give thanks for the bounty that we enjoy, and that couldn't be truer each day for the support we receive in editorial, advertising, and marketing of our daily, weekly, and monthly publications. It's a pleasure to contribute to the industry—and to receive contributions. Read our Thanksgiving message and then enjoy your turkey day.
Northrop Grumman to Enhance UH-60V Aircraft Capabilities
Northrop Grumman Corporation has been selected to provide engineering services for the KBR-led $156.7 million, five-year Department of Defense Information Analysis Center’s (DoD IAC) multiple-award contract (MAC) vehicle.
ICAPE USA's Jeremy Griner Talks Market Conditions
ICAPE USA managing director Jeremy Griner discusses current market conditions for PCB fabrication and shares the ICAPE perspective on which industries are experiencing growth. Griner also outlines how ICAPE is navigating current shipping and logistics challenges while continuing to grow sales during these dynamic times.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.
PCB Carolina Breaks Attendance Record
PCB Carolina has been growing consistently for the past decade, and this year the show reached a milestone: more than 1,000 attendees. Yesterday, the show was the busiest I’ve ever seen it; I almost had to park off the NC State University campus. Fortunately, I’m an expert at “the parking lot game.” I waited until a guy was leaving and then I sniped his spot. Bam!
IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
NASA Continues Psyche Asteroid Mission
Earlier this year, Psyche missed its planned 2022 launch period as a result of mission development problems, leading to an internal review of whether the mission would be able to overcome these issues to successfully launch in 2023.
EIPC Technical Snapshot: ‘Tremendous Uncertainty’ in Global PCB Marketplace
For the past two years, EIPC’s Technical Snapshot series has kept us extremely well-informed on developments in printed circuit materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? The 19th chapter (coincidentally on Oct. 19) in the series gave us a privileged opportunity to find out, as two leading industry analysts presented their observations and opinions in a webinar introduced and moderated by EIPC technical director Tarja Rapala-Virtanen.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation! This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about?
EMA Helps Ease Designers’ Supply Chain Woes
Supply chain issues are continuing to cause disruptions in our industry, though lead times have dropped from astronomical to merely troublesome. In this interview, Chris Banton, EMA Design Automation’s director of marketing, explains how Cadence’s software has evolved as designers’ needs have changed in the past few turbulent years, including providing designers with component availability data early in the process.
Sunstone and I-007eBooks Launch Book on Designing for Reality
I-007eBooks is excited to announce the release of the latest title in its series for designers, The Printed Circuit Designer’s Guide to… Designing for Reality. This book covers both written and unwritten rules for how to create a realistic, manufacturable design.
PCB Legislative Update: HR 7677
Electronic industry association leaders like IPC, PCBAA, and USPAE have been trekking to Capitol Hill almost weekly this year to reinforce the dire state of the industry and seek additional co-sponsors for HR 7677, a bill supporting the American printed circuit board industry. However, with only 78 days until the end of the 117th Congress, it is not likely that anything will move by the end of this session.
IPC Advanced Packaging Symposium: An Urgent Need to Support Global Efforts
After two days of presentations, panel discussions, and impromptu hallway conversation at the IPC Advanced Packaging Symposium, one thing became clear: There is an urgency to support advanced packaging in all regions across the globe. The symposium, Oct. 11-12 in Washington, D.C., concluded with what seemed to be a great deal of expanded perspective for those who attended.
Intel Joins DARPA’s Space-BACN to Accelerate Inter-Satellite Communications
The U.S. Defense Advanced Research Projects Agency (DARPA) has selected Intel for Phase 1 of the Space-Based Adaptive Communications Node (Space-BACN) program, which aims to create a low-cost, reconfigurable optical communications terminal that will translate information between diverse satellite constellations.
IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs
There is a significant capability gap in advanced substrate packaging in North America, forcing all semiconductors to be packaged in Asia and leaving North America at risk in its supply chain. This was a common theme during a two-day IPC Advanced Packaging Symposium, which launched yesterday at the Kimpton Monaco hotel in Washington, D.C.
Viasat, Inmarsat Confident their Combination Benefits Consumers
Viasat Inc. and Inmarsat remain committed to working with the UK’s Competition and Markets Authority (CMA) to demonstrate how their planned transaction will benefit airline, passenger, and enterprise users of In-Flight Connectivity (IFC) in aviation businesses.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, our five must-reads include the IPC report on the EMS industry and a report on ICs for the automotive market. Add to that Lockheed’s highest powered DoD laser yet, IPC’s APEX keynote announcement, and—for you conference and expo junkies—a calendar of upcoming industry events. I can’t help but notice that much of our news is about, well, something new. In this case, my editor’s picks for the week capture new technology, new perspectives, new ways to communicate content, and new developments that we can expect to see in our future daily life. To borrow a phrase from the TV show “Firefly,” everything is “shiny” this week. I will be at PCB West, the IPC Advanced Packaging symposium, SMTA International, and electronica. If you see me, say hello, and share something cool about the part of the industry you’re in.
Michael Carano: A Focus on Process Control, Part 2
In this second half of our conversation, Michael Carano discusses some of the metrics that fabricators need to consider before investing in new processes, especially process control technologies, and some of the challenges board shops face updating brownfield sites.
The New World Order of JIC
The great business thought leader Margaret Heffernan commented that we are changing from just-in-time (JIT) to just-in-case (JIC). As we’ve worked our way through the issues of the past two years, the world is changing from a complicated to a complex system, and we must be prepared to face the challenges it brings. To survive today, we need the JIC mentality. We must be prepared for the unexpected. No longer can we rely on cycles and patterns to predict the future, or what we might be able to handle based on what that future brings. Now we must prepare for the unexpected. We must be flexible and able to adapt to whatever comes our way.
A Focus on Process Control, Part 1
Michael Carano is a noted subject matter expert with respect to process control, electroplating and metallization technology, surface finishing, and reliability. So, it was only natural that we sat down to talk about mechanizing an existing facility given today’s fickle environment. Will any of the CHIPS funding trickle down to bare board fabrication? What process can be adjusted on the factory floor? The focus needs to be more than just on manufacturing and getting work out the door, he says, but also process control.
Designing Through Supply Chain Pain
Engineers are accustomed to the demanding challenges of designing for miniaturization, cost reduction, cross platform compatibility, and harsh environments. What has proven to be the most painful experience of my career (and for many of my colleagues) is the sheer lack of components from which to build our designs. Development cycles—commercial, industrial, medical, avionics—have been severely impacted, from large enterprise corporations to small design/integration companies. Awareness of the situation is the first step to understanding the underlying problems faced by today’s design engineers industry wide. Here are a few of the situations I have faced in the last year alone.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai! But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?
Will Marsh: CHIPS Act Update
Now that the CHIPS Act has become law, Nolan Johnson reconnects with PCBAA President Will Marsh to ask the question: What now? Will brings Nolan up to speed on the initial stages of implementation and administration, and provides more insight on the Supporting American Printed Circuit Boards Act of 2022.
A Deeper Look at the CHIPS Act Investment
In this interview with Chris Peters at U.S. Partnership for Assured Electronics (USPAE), Nolan Johnson seeks for better understanding regarding the implications of funding the CHIPS Act. Frankly, where and how will the $52 billion be spent? Who will decide how the funds are allocated? And surprisingly, who will benefit the most from this boost into the microelectronics industry?
What’s Going On in Congress? Your Handy Guide to PCB Legislation Headlines
We know you have so many questions about what the legislation means for you. Will there be funds to expand or upgrade my facilities? What about tax breaks? How will my specific needs be known? What will the current legislation mean for U.S. vs. China relations? Use this handy guide to get caught up, sort out the CHIPS from the USICAs, and be that someone who talks knowledgably at dinner parties.
IPC Advanced Packaging Symposium to Draw Industry, Government Representatives
Nolan Johnson speaks with IPC’s Chris Mitchell, vice president of global government relations, and Matt Kelly, chief technologist, about the inaugural IPC Advanced Packaging Symposium, scheduled for October 11-12, 2022 in Washington, DC. In this conversation, Mitchell and Kelly detail the symposium's objectives, presenters, and the value to both fabricators and assemblers in attending.
NASA Awards Next-Generation Spaceflight Computing Processor Contract
NASA’s Jet Propulsion Laboratory in Southern California has selected Microchip Technology Inc. of Chandler, Arizona, to develop a High-Performance Spaceflight Computing (HPSC)?processor that will provide at least 100 times the computational capacity of current spaceflight computers.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
There was some good news this week, as Republicans and Democrats managed to cooperate long enough to pass the CHIPS Act. Members of the House and Senate don’t usually act until they get worried about being voted out of office, so pardon me if I’m not ready to sing “Happy Days Are Here Again” just yet. But this is still really good news; the politicians are on the record now, and we can hold them accountable.
Excerpt Chapter 5: 'The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2'
Chapter 5 of the 2nd Volume from The Printed Circuit Designer's Guide to... Thermal Managment with Insulated Metal Substrates provides examples of thermally enhanced prepregs and cores now available in the market with the versatility to solve a wide variety of challenges. Included in this chapter you will find examples of simple designs and more complex hybrid assemblies that combine multilayer and single-layer areas on the same board.
Excerpt: 'The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2'
As the second in this two-part series, The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art builds on the material presented in the first book by describing up-to-the-minute products and design techniques for thermal management with IMS.
New Book from I-Connect007 Examines Evolution of Electronics Industry NPI
The Electronics Industry’s Guide to… The Evolving PCB NPI Process is the first book in I-Connect007’s new The Electronics Industry’s Guide to… technical series. This valuable resource is for all segments of the electronics interconnect industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Our biggest news this week: I-Connect007 has been acquired by IPC. Every member of the team, including founder and Publisher Barry Matties, is included in this deal. We’ve enjoyed working closely with IPC for decades, especially at events like IPC APEX EXPO, and we have four IPC columnists writing in our magazines and newsletters. This move makes sense for both parties. It enables us to take our magazine, newsletters, and book publishing to the next level, and IPC won’t have to spend years building a media company from the ground up. It really is a win-win.
IPC Acquires Media Company I-Connect007, Strengthening Relationship to Drive Growth and Innovation in the Electronics Industry
IPC, a global electronics manufacturing industry association, has acquired media company I-Connect007, a global source for news and original content serving the printed circuit design, fabrication and assembly/EMS markets.
PCB Finance Class With Jeff De Serrano
Class is in session! PCB Technologies President Jeff De Serrano takes us through some of the struggles of the PCB industry over the past 30 years, how U.S. legislation seeks to level the playing field, and whether a “monopoly” of fabricators is healthy for our industry. In his chat with Nolan Johnson, Jeff gets out his investment playbook and talks strategy. Don’t miss this one.
FLEX Conference 2022: If You Build It, We Will Buy It
Key presentations from companies like Boeing highlight FLEX Conference and Exhibition 2022, held in concert with the annual SEMICON West show this week in San Francisco’s Moscone Center. SEMICON West claims to be “North America’s premier microelectronics exhibition and conference,” uniting players across the entire electronics manufacturing and design supply chain.
Time to Get Serious About CMMC Readiness
Divyash Patel of MX2 Technology is a leading cybersecurity expert who’s sounding the alarm about getting your company into a state of readiness. But he’s not yelling fire in a theater. Whether it’s aligning with DoD’s CMMC, or just ensuring your company’s data and processes are protected, Divyash can see what’s coming. “This is a must-have compliance program,” he says. “It needs to be taken seriously and maintained.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In more than one conversation while discussing the industry this week, the themes have included industry turmoil, lots of business opportunities, and the urgent need to build out to meet changing demands. In fact, our July issue of PCB007 Magazine, which publishes later this month, will focus on these very topics. It’s definitely one not to be missed!
These themes also emerged in this week’s top five news items as well. Top stories include an acquisition in the soldering machinery space, sales and service expansion in Mexico, industry data from SIA on semiconductor global sales data, and strong financial numbers from two China-based manufacturers. Now, with the U.S. Congress putting its focus on the PCB industry, things could really heat up. It’s going to be an interesting year.
The U.S. Economy Needs the Bipartisan Innovation Act and the PCB Act
In this IPC-created interview between Dale Curtis, IPC Advocacy Communications and Chris Mitchell, IPC VP Global Government Relations, the importance of the semiconductor and PCB manufacturing legislation moving through US Congress is highlighted.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Market news was certainly big this week. While the U.S. stock market continues make some large swings, the PCB and PCBA are doing their own dance with the numbers. We’re still feeling the effects of the pandemic, but it seems to be more about playing catch up. Still, the industry is showing some instability, both in positive and negative ways.
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, "The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2." This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.
Review: Institute of Circuit Technology 2022 Annual Symposium
The British Motor Museum in Warwickshire, housing the world's largest collection of historic British cars, was venue for the 2022 Annual Symposium of the Institute of Circuit Technology on June 8, which attracted a substantial gathering of manufacturers and suppliers from the UK printed circuit industry. ICT chair Emma Hudson reflected upon lessons learned during the pandemic lock-down and how the industry has successfully adapted to circumstances. She commented that the UK’s PCB fabricators are extremely busy, as she introduced an outstanding conference programme including a keynote from the incomparable Happy Holden.
PCB Technologies' Subsidiary iNPACK to Exhibit at IMS Show
Jeff De Serrano, president of PCB Technologies USA, discusses the launch of their new company, iNPACK, which focuses on high-tech substrate technologies, microelectronics assembly, and electronics packaging. He details his plans to continue expanding InPack over the next year and to meet with customers and exhibit at the International Microwave Symposium Show in Denver June 19-24.
The Double-edged Sword of CMMC 2.0
For the past few years, those whose SMT provider organizations supply or contract with the U.S. Department of Defense (DoD) have been hearing about—or even gearing up for—implementation of the Cybersecurity Maturity Model Certification program, better known as CMMC. By this, I mean that you were gearing up for CMMC 1.0. Today, we have CMMC 2.0, and there are a number of changes in the new version that impact both the standards for compliance and how you certify that compliance—especially if you run a small business.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Things are heating up in the world of PCB design and manufacturing as well. In the past week, we published quite a bit of news—some good, some not so good. Some of the news is mixed, as we see with the EMS industry shipments rising YOY in April, but falling from the previous month. It’s nice to see NASA investing in American small businesses, but they didn’t really have a choice, did they?
NASA Supports Small Business Research to Power Future Exploration
NASA has selected hundreds of small businesses and dozens of research institutions to develop technology to help drive the future of space exploration, ranging from novel sensors and electronics to new types of software and cutting-edge materials. The project, funded by NASA’s Small Business Technology Transfer program, could help improve the efficiency of solar cells for space missions and use on Earth.
Jahr Turchan Discusses Blackfox's Training Scholarships for Veterans
Nolan Johnson recently interviewed Jahr Turchan, director of Veteran Services & Advanced Manufacturing Programs for Blackfox Training Institute. They discussed some of the new programs at Blackfox, including the Veteran Advanced Manufacturing Certification program. Thanks to programs like these, this is a great time for veterans transitioning into the manufacturing workplace.
PCB Technologies’ InPack to Focus on Miniaturization, Packaging
I recently spoke with PCB Technologies’ Jeff De Serrano, Yaniv Maydar, and Alon Menache about their new venture, InPack. They explain their plans to focus on advanced packaging, miniaturization, and other high-end technology, with much faster time to market, and they offer a view of the global market as well.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.
Exploring High Density With Axiom
Nolan Johnson and Barry Matties talk with Axiom’s Rob Rowland and Kevin Bennett about the current high-density challenges facing EMS manufacturing. In this interview, Bennett and Rowland zero in on component packaging and feeder technology as critical areas in need of improvement.
PCBAA Member Profile: Davy Nakada, Rogers Corporation
Our industry has suffered from a lack of visibility with policymakers. PCBAA brings many voices together so those in Washington realize what's at stake. Semiconductors have received the most attention in recent years while the domestic production of PCBs and related PCB materials continues to decline. We are now seeing legislative language supporting domestic production because of how PCBAA has educated lawmakers and policymakers on the PCB’s place in the microelectronics ecosystem.
Elbit Systems UK JV Introduces Sustainable Aviation Pathfinder for Ministry of Defence
Elbit Systems UK and KBR Inc’s joint venture, Affinity Flying Training Services Ltd (Affinity), has embarked on a series of battery-powered flight tests for the UK Ministry of Defence to assess the feasibility of environmentally friendly alternatives to current military aircraft.
The Reality of Regulated Manufacturing
Nolan Johnson speaks with Ryan Bonner, CEO of DEFCERT, about government regulations for data and cybersecurity. A key component of moving to a digital factory will be to ensure security of the data required to operate a digital factory, and most importantly, customer design data.
Additive Design: Same Steps, Different Order
We recently spoke with Dave Torp, CEO of Winonics, about the company’s additive and semi-additive processes and what PCB designers need to know if they’re considering designing boards with these new technologies. As Dave explains, additive design is not much different from traditional design, but the steps in the design cycle are out of order, and additive designers must communicate with their fabricators because so much of the new processes are still proprietary.
Catching Up With Alpha Circuit’s Prashant Patel
There is plenty of evidence that the American PCB industry is going through a revitalization. While a few new companies are being established, others are being rejuvenated as investors gain more interest and confidence in domestic PCB companies. I reached out to Prashant Patel, owner and president of Alpha Circuit I LLC in the greater Chicago area. I wanted to hear about his investment and the unique path he took to owning a PCB shop.
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