Dan’s Biz Bookshelf: ‘Abundance: How We Build a Better Future’
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
It’s Only Common Sense: The Phone Is Still Your Competitive Advantage
IPC to Debut Flexible Hybrid PEC Pavilion at IPC APEX EXPO 2017
September 22, 2016 | IPCEstimated reading time: 1 minute
IPC will debut a new pavilion focusing on flexible hybrid printed electronics at IPC APEX EXPO 2017 in San Diego. IPC APEX EXPO is excited to have a dedicated area to promote flexible hybrid printed electronics and support this growing technology.
The Flexible Hybrid Printed Electronics Pavilion will showcase the growing printed electronics technology sector and how these technologies also apply to hybrid PCBs and PCB assemblies. This will provide IPC APEX EXPO attendees with an opportunity to explore topics and vendors in a centralized location. Visit www.IPCAPEXEXPO.org or contact Maria Labriola, manager of tradeshow sales, MariaLabriola@ipc.org for details on exhibiting.
In addition to the show floor pavilion, the planned Flexible Hybrid Printed Electronics programming will include:
- Technical paper sessions
- Management-focused Buzz Session
- Standards meetings
“Flexible hybrid printed electronics is an area of great interest for IPC APEX EXPO attendees,” said Chris Jorgenson, IPC director of technology transfer. “This pavilion on the show floor and the supporting events during the show will provide a valuable opportunity for attendees to network and learn about these trending products and technologies.”
Registration for IPC APEX EXPO is now open. For more information, please visit www.IPCAPEXEXPO.org.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Kimball Electronics Reports Q3 Results With Double-Digit Sequential Medical Sales Growth
05/07/2026 | Kimball ElectronicsKimball Electronics, Inc. announced financial results for the third quarter ended March 31, 2026.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
IMI Reports Stronger Performance and Return to Profitability in 2025
05/06/2026 | IMIIntegrated Microelectronics, Inc. (IMI) reported a significantly improved performance in 2025, reflecting the positive results of its multi year transformation focused on operational efficiency, portfolio optimization, and strengthening core capabilities.