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Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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EIPC SpeedNews: News from the European PCB Industry
October 4, 2016 | EIPCEstimated reading time: Less than a minute
- Review EIPC Reliability Workshop, Tamworth
- What do EMS Providers Sanmina, Eolane, Asteelflash, BMK and Prettl have in common?
- Save the date: EIPC Winter Conference Salzburg, February 2 & 3, 2017
- Digitaltest Germany's success continues with new, expanded production site
- SOMACIS at electronica 2016
- Cicor presents: DenciTec – a PCB technology that takes miniaturization to the next level
- Senior industrial engineers join Loughborough University's teaching staff. One of them is Prof. Martin Goosey
- ICT Harrogate Winter Seminar 2016
- Inaugural 'ScoopTalk' Takes Event Video to the Next Level
- Ventec International appoints Denis McCarthy Jr. as technical sales account manager
- Seica SpA participation at Electronica, Munich, November 8–11, 2016
- News from IPC
Suggested Items
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Zhou (Peter) Guoyin: Pioneering the Standardization of ESG
12/23/2024 | Chuck Li, IPC AsiaWith more than 30 years of experience in corporate social responsibility (CSR) and environmental, social, and governance (ESG), Zhou (Peter) Guoyin has not only witnessed the evolution of CSR and ESG globally but has also been a key force in driving their development. As chair of the IPC-1401 standard committee, Zhou has led numerous innovative projects over the past 11 years and was awarded the SEDEX Supply Chain Impact Award in August 2024. In this exclusive interview, he shares valuable insights into the ESG field and the profound impact of IPC-1401 on the electronics manufacturing industry.
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.