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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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PCB Executive Forum Focuses on Critical Issues
November 16, 2016 | IPCEstimated reading time: 2 minutes
IPC – Association Connecting Electronics Industries announces the new PCB Executive Forum Presented by IPC Hall of Fame. This is a learning and networking forum for senior-level executives of PCB organizations, fabricators, and their suppliers. The forum will take place February 13, 2017 at IPC APEX EXPO 2017 in San Diego, California.
Top on the agenda is delivering insight into and information on how PCB companies can survive and thrive in today’s business environment. Presentations will cover: using venture capital funding for small businesses with big ideas, disruptive technologies, 3-D printing, fabricators and their supply chain in China, flexible hybrid electronics, product reliability, industry challenges and more. Speakers include: Brad Bourne, FTG Circuits; Mike Mayer, Continental; Joan Vrtis, Multek, Inc.; Dan Feinberg, Fein-Line Associates, Hamed El-Abd, WKK Distribution; and Paul Semenza, NextFlex.
“We’re at a pivotal time in our industry when the choices company leaders make today can have a tremendous impact on whether the company remains competitive tomorrow,” says Gene Weiner, PCB Executive Forum program chair. “The industry experts we’ve assembled for this event will provide important insight on critical issues such as market trends, customer requirements and the economy – issues that decision makers are facing right now.”
Forum speaker Alan Rae, Ph.D., executive director at Incubator Works, echoes the sentiment, “The electronics industry is in the middle of many transitions – desktops to handhelds, local hard drives to the cloud, the end of Moore’s law, the Internet of Everything and the rise of non-traditional ways of producing circuits. This is a time of great challenge and of great opportunity. It’s time to take a deep breath and review some of these opportunities and the PCB Executive Forum is the perfect event to do so!”
Information and registration for the IPC Executive Forum is available online here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,800 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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