It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Ventec International Group to Focus on High Thermal Performance Materials for Automotive/LED at HKPCA
November 29, 2016 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group will exhibit in Booth #4B16 at HKPCA, China, scheduled to take place December 7th-9th, 2016 at the Shenzhen Convention & Exhibition Center, China.
At HKPCA 2016 on booth #4B16, Ventec's team of materials experts will present the company’s next generation materials including the latest low loss material range and ultra-thin laminates and prepregs. Show-highlights will feature the latest advances in high performance IMS materials that deliver an exceptional thermal performance, reliability and quality, particularly demanded by automotive and other LED lighting and DC power conversion applications.
Visitors to the booth will also discover the latest developments in polyimide technology and Ventec's advanced high speed/low loss product line 'tec-speed', and will be introduced to the company’s newest ranges of PCB base-materials including complementary products such as flex- & rigid-flex circuit board materials, back-up, entry & routing materials, foils and coatings.
Ventec International Group’s COO Jason Chung commented: “Demand for high performance materials, particularly for high-end storage, telecommunications and automotive applications requiring high signal transmission speed and low transmission loss, is driving the advancement of high speed and high frequency solutions. Furthermore, increased miniaturization and higher component density, driven by greater functional demands from consumer, automotive, mil/aero and medical applications and devices, are accelerating rapid advances in laminate technology for next generation PCB’s. Ventec is at the forefront of these developments and we work in partnership with our customers to co-develop next generation products that meet their requirements and help them select and specify the best materials that will enable optimum product performance and cost-effectiveness without compromising manufacturability or functionality.”
About Ventec International Group
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Share on:
Suggested Items
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
11/27/2024 | Team NCAB -- Column: Fresh PCB ConceptsElectric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche dives into the role of printed circuit boards (PCBs) in electric vehicle charging (EVC)—and the design considerations.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.