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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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ECHA Adds Four Substances to REACH Candidate List
January 4, 2017 | IPCEstimated reading time: Less than a minute
Four more substances will be added to the REACH candidate list in January after ECHA’s Member State Committee unanimously agreed they should be designated as substances of very high concern (SVHC). This will bring the total number of substances on the list to 173.
The four substances are bisphenol A, the perfluorinated chemical PFDA (nonadecafluorodecanoic acid) and its sodium and ammonium salts, 4-heptylphenol, branched and linear (4-HPbl), and 4-tert-pentylphenol (PTAP).
Two additional substances, 4-tert-butylphenol (PTBP) and trimellitic anhydride (TMA), were not unanimously supported for inclusion and will be submitted to the European Commission for consideration.
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Anda Technologies Marks 25 Years of Innovation in Automation
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Flexible Temperature Profile for Reflow Soldering: The TCS for the Vision Series by Rehm Thermal Systems
06/07/2023 | Rehm Thermal SystemsThe ideal temperature profile required for soldering an electronic assembly is subject to a number of factors, including the soldering paste, the components, the circuit board as well as specific production conditions.
FKN Systek Singulates Thin V-scored Panels with Close Component Spacing
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Revolutionizing Radar Signal Processing
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