-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Meyer Burger Receives Order for Multiple Solder Resist Printing Tools
February 2, 2017 | Meyer BurgerEstimated reading time: 2 minutes

Meyer Burger (Netherlands) has received an order for multiple JETx SMP inkjet production printers for the application of solder mask from a major European PCB manufacturer. The order represents a strong signal from the PCB market that it is ready to adopt inkjet printing of solder mask and its many benefits as compared to existing screen print and photo imaging processes. Furthermore it demonstrates the market’s recognition of Meyer Burger’s leading position with its PiXDRO inkjet technology and printing expertise.
Direct printing of solder resist has a great number of advantages. It omits coating, exposure and development processes, saving cost and improving yield. It also helps to reduce material consumption and waste streams. However, solder mask printing requires a next level of process and equipment engineering when compared to legend printing. It requires full size, multi-head and high accuracy printing equipment and process development in close collaboration with leading solder mask ink vendors. Because of these attributes, combined with its long standing experience in functional inkjet process development and equipment engineering, Meyer Burger has secured these first orders in solder resist printing.
About Meyer Burger
Meyer Burger is a leading global technology company specialising on innovative systems and processes for manufacturing of electronics. The company’s focus is on photovoltaics (solar industry) while its competencies and technologies also cover important areas of the PCB, semiconductor and the optoelectronic industries as well as other selected high-end markets based on electronics materials.
The company’s comprehensive product portfolio is complemented by a worldwide service network with spare parts, consumables, process know-how, customer support, after-sales services, training and other services. Meyer Burger is represented in Europe, Asia and North America in the respective key markets and has subsidiaries and own service centres in China, Germany, India, Japan, Korea, Malaysia, the Netherlands, Switzerland, Singapore, Taiwan and the USA.
About PiXDRO
With its PiXDRO inkjet technology, Meyer Burger is leading in the field of functional inkjet printing. PiXDRO JETx printers are equipped with piezoelectric, drop-on-demand inkjet technology and are ready for printing conductive, dielectric, resist, adhesive and other functional materials for applications in printed and flexible electronics, PCB, OLEDs, sensors, semiconductors, MEMS, chemical machining, 3D printing, photovoltaics, life science, and optics.
The PiXDRO product offering includes JETx production equipment, research and development tools, process support, training and service and is complemented by a strong network and knowledge base in inkjet materials and head technology. For more information visit our booth (#1125) at IPC APEX or our website: www.meyerburger.com.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.