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Arlon EMD and Doosan Electro-Materials BG to Exhibit at IPC APEX EXPO 2017
February 8, 2017 | Arlon EMDEstimated reading time: 1 minute
Arlon Electronic Materials, a specialty materials supplier based in Southern California, will be teaming up with Doosan Electro-Materials BG, at the IPC APEX EXPO 2017. Doosan will be promoting DS600 Flexible Copper Clad Laminates and DS7402, Halogen Free, High Tg FR-4 materials. Arlon will be highlighting the technological advantages of several specialty materials including the recently released, 85HP high performance polyimide system along with the reintroduction of multiple nonwoven aramid reinforced products.
Arlon’s recent distribution agreement with Doosan Electro-Materials BG will allow Arlon to provide sales and technical support of various products from Doosan. For Arlon EMD, this agreement enables expansion of product line offerings into the electronic materials industry, while enhancing Arlon’s focus on rigid-flex applications for military, avionics and space market segments.
The IPC APEX EXPO 2017 show will take place February 14th thru 16th, 2017 in San Diego, California. Arlon EMD and Doosan Electro-Materials BG will be located at booth # 3602.
About Arlon: Arlon EMD is a privately held, veteran owned, US manufacturer and distributor of specialty materials. Arlon has supplied materials for the N. American, UK and European markets for more than 25 years from their manufacturing location in Rancho Cucamonga, California.
For additional information, please visit our website.
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11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
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Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.