-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Gary Ferrari Earns Dieter Bergman IPC Fellowship Award
March 2, 2017 | IPCEstimated reading time: 2 minutes

In recognition of his ongoing leadership in developing and promoting IPC standards on a global basis, IPC – Association Connecting Electronics Industries bestowed the Dieter Bergman IPC Fellowship Award upon Gary Ferrari of FTG Circuits.
This recognition is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry and embody the work ethic and spirit of the late Dieter Bergman… a pioneer and industry icon. Award recipients are eligible to bestow the Dieter Bergman Memorial Scholarship upon the university or college of his/her choice and Ferrari’s selection was the University of Connecticut, Electrical and Computer Engineering program.
For more than four decades, Ferrari has donated countless hours to IPC and his list of achievements is vast. He spearheaded IPC’s highly successful PWB Designer Certification program, which has trained and recognized more than 6,500 designers to date. In addition, he co-founded the IPC Designers Council, and served as its executive director for many years. Ferrari is currently a member of the IPC Designers Council Executive Board and is a member of the Designers Council Education Committee.
His work on standards committees has been long-standing and impactful. He currently serves on four dozen technical committees with a leadership role in four.
He is a member of the Technical Activities Executive Committee (TAEC) and served as a TAEC chair.
"IPC and the entire electronics industry are fortunate to have Gary volunteer his time and expertise to IPC standards and program development," said John Mitchell, IPC president and CEO. "His work has enriched both the industry and IPC and we are thankful for his dedication."
For more information on the Dieter Bergman IPC Fellowship Award and this year's award recipient, contact Sandy Gentry, IPC communications manager, at +1 847-597-2871.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,900 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPODevan Iyer, the Chief Strategist for Advanced Packaging at IPC, shares insights from his recent presentation at the EMS Leadership Summit. The discussion covers the importance of understanding market segments in IoT, power electronics, and high-performance computing. EMS companies are encouraged to specialize, invest wisely, and collaborate to meet customer needs.
Rogers Reports Q1 2025 Results
04/30/2025 | Rogers CorporationNet sales of $190.5 million decreased 0.9% versus the prior quarter. Advanced Electronics Solutions (AES) net sales increased by 1.8% primarily related to higher ADAS and aerospace and defense sales, partially offset by lower EV/HEV and industrial sales. Elastomeric Material Solutions (EMS) net sales decreased by 4.3% primarily from a seasonal decline in portable electronics sales and lower EV/HEV sales, partially offset by higher general industrial sales.
Kasuo Electronics Launches Advanced Testing Laboratory to Strengthen Global Supply Chain Quality Assurance
04/29/2025 | BUSINESS WIREKasuo Electronics Co., Ltd, a globally recognized trader of electronic components, has officially operationalized its state-of-the-art testing laboratory.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.