USC’s Information Sciences Institute Tapped to Produce Computing Chips Technology
April 11, 2017 | USCEstimated reading time: 1 minute
The Information Sciences Institute at the USC Viterbi School of Engineering has been awarded a $30.9 million contract to develop technology ensuring that computing chips are manufactured with minimal defects.
The team led by Principal Investigator John Damoulakis, a senior director for advanced electronics at USC ISI, includes researchers from USC’s Ming Hsieh Department of Electrical Engineering, Stanford University, Northwestern University and the Paul Scherrer Institute at the Swiss Federal Institutes of Technology.
“We are thrilled that the award will allow ISI to provide commercial, academic and government entities with reliable and economical access to electronics that are free of manufacturing defects,” said Premkumar Natarajan, the executive director of ISI.
The USC team was selected, among others, because of its expert knowledge of microelectronics, microscopy and high-performance computing, as well as its ability ability to deliver research to the U.S. government that pertains to the manufacturing of reliable nano-electronics, he explained.
“Nano-imaging is technology of the future. The USC team will image features in chips that are about 5,000 times smaller than a human hair and make them visible to the human eye for analysis and experimentation,” Natarajan said.
“This capability can lead to the discovery of new materials and pharmaceuticals and advance the understanding of biological structures, thus opening a new realm of research at USC.”
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.