The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Compunetics Obtains New MIL-PRF-31032 Certifications, Expands PCB Offerings
July 10, 2017 | CompuneticsEstimated reading time: Less than a minute
Compunetics, Inc. is newly qualified by Defense Logistics Agency (DLA) (VQE-17-031349) to provide multilayer flex printed circuit boards per MIL-PRF-31032/3 & MIL-PRF-31032/4 certifications and standards. These qualifications, effective 5/4/2017, allow Compunetics to build flexible circuit boards with up to five layers.
Compunetics is certified to MIL-PRF-31032/1 and /2 for rigid PCBs for up 24 layers using FR-4 materials. Additional certifications include the capability to produce PCBs up to 18 layers composed of a mix of FR-4 and ceramic filled hydrocarbon material.
Compunetics is pursuing a new DLA qualification that would certify them to manufacture 14-layer rigid-flex boards. This certification acquisition is expected in the fall of 2017.
About Compunetics, Inc.
Compunetics, a subsidiary of Compunetix Inc., was established in 1968 and has since been engaged in the design and manufacture of special systems for complex information processing applications. In 1969, the company began manufacturing printed circuit boards. Currently, Compunetics’ capabilities include the fabrication of rigid, flexible and rigid-flex printed circuit boards. More information regarding the company can be found here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout
Zhen Ding Technology Highlights AI-Driven Transformation of the PCB Industry at SEMICON Taiwan 2025
09/11/2025 | Zhen Ding TechnologyArtificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
ASC Sunstone Circuits to Exhibit at AEMS 2025
09/09/2025 | American Standard CircuitsASC Sunstone Circuits will be exhibiting at AEMS 2025 (Anaheim Electronics and Manufacturing Show) to be held at the Anaheim Convention Center on September 24 and 25, 2025.