One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
The Knowledge Base: Challenges and Considerations of Harsh Environments
Indium to Feature Ultra-Low Voiding Solder Paste at SMTAI 2017
July 27, 2017 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its ultra-low voiding Indium10.1HF solder paste—which helps customers avoid the void—at the SMTA International Technical Conference, to be held September 17–21, 2017, in Rosemont, Illinois.
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.
The flux chemistry is specifically engineered to improve reliability with:
- High ECM performance under low standoff components
- Outstanding solder beading
- Very low bridging, slump, and solder balling
- Resistance to head-in-pillow
- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
- High print transfer efficiency with low variation
Indium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN14582.
For more information about Indium Corporation’s low-voiding solder pastes, click here or see Indium Corporation at Booth 517.
Share on:
Suggested Items
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).
Technica USA and Electra Polymers: Driving Success in Ink Jet Solder Mask Across North America
02/27/2025 | Technica USATechnica and Electra Polymers have achieved remarkable success in the ink jet solder mask market. Electra Polymers is the dominant force in North America, holding an overwhelming market share north of 80% with its ElectraJet® EMJ110 solder mask.