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Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
October 30, 2025 | Real Time with...SMTAIEstimated reading time: Less than a minute
Joel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
Click here to watch now!
For more coverage from the event, visit the Real Time with... SMTA International 2025 site.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Koh Young Recognized with Productronica Innovation Award
12/09/2025 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, has been recognized with a Productronica Innovation Award for its breakthrough KPO solution.
Koh Young Highlighting 3D Inspection for Advanced Packaging at SEMICON Japan 2025 in Tokyo Big Sight
11/24/2025 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, will showcase its latest semiconductor inspection portfolio at SEMICON Japan 2025, held from December 17 to 19 at Tokyo Big Sight in Booth E5528.
Merlin PCB Group Invests in 2 CIMS Galaxy 25µ AOI Machines
11/13/2025 | Merlin PCB GroupThe Merlin PCB group has invested in CIMS Galaxy 25µ AOI machines, one for Merlin Flex in Hartlepool and the other for Merlin Circuit Technology in Hawarden.
GenI Generative AOI Programming Debuts: Mycronic Sets a New Standard in AOI Automation
11/10/2025 | MycronicMycronic’s PCB Assembly Solution division announces the launch of GenI™, an industry first solution designed to liberate electronics manufacturers from the complexities of traditional Automated Optical Inspection (AOI) programming.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.