-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA International 2017 a Success
September 27, 2017 | SMTAEstimated reading time: 1 minute
The 2017 SMTA International Conference and Exhibition, which took place September 17 – 21, 2017 at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. A record number of international attendees from 22 countries were registered this year.
The technical conference continued the tradition of being the strongest in the electronics assembly industry. The Technical Innovations Symposium at the beginning of the week received much praise as it covered Micro-Dispensing and Additive Manufacturing Developments, Adhesive and Coating Development and Characterization, and a Lead-Free Current/Future Presentations Panel Discussion. The Technical Innovations Symposium keynote presentation by iNEMI’s Bill Bader on the 2017 Roadmap Highlights was well-received by attendees.
The Women’s Leadership Program brought together speakers from IBM, Intel, FLITE, WNIE, and Women in Manufacturing on Monday afternoon. The program closed with a panel discussion about diversity in the workplace followed by a wine and cheese reception.
On Tuesday morning a crowd filled the Keynote Presentation Session until it was standing-room-only to hear Microsoft’s GM of HoloLens Hardware Design, Rune Jensen, share his experiences developing the company’s premier mixed reality device. The presentation included several videos demonstrating the advanced capabilities of the HoloLens. The presentation inspired attendees to imagine how a device like this could change the future of manufacturing.
The Lead-Free Soldering Technology Symposium as well as the expanded Advanced Packaging, Manufacturing Excellence, Inspection Technologies, and HDP Consortium tracks kept the meeting rooms full until the very end of the conference on Thursday.
Over 170 exhibiting companies filled the exhibit hall, bringing more equipment and new products than past years. Traffic on the show floor was noticeably higher this year.
Once again the Tech Tour program featured distinguished tour guides leading groups of attendees to exhibiting companies demonstrating new products and test equipment.
Next year the SMTA International Conference and Exhibition will be held October 14 - 18, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois. The IPC Fall Standards Development Committee Meetings will again be co-located.
About SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here.
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.