-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Keith Bryant to Present on Behalf of YXLON International at productronica
October 18, 2017 | YXLON InternationalEstimated reading time: 3 minutes
YXLON International, a company of the Swiss tech holding, Comet Group, is pleased to announce that Keith Bryant, Global Director Electronics Sales, has been selected to present during productronica Messe München in Germany. Bryant will speak during the SMTA Technical Program in the SMT Speakers Corner (A1.220) on Thursday, Nov. 16, 2017 from 1-1:30 p.m. The presentation will look at the advantages that cross over X-ray systems, like the YXLON FF35 CT, bring to CT imaging in electronics failure analysis and in-depth fault finding. Bryant will discuss the latest technologies and show stunning reconstructions.
Additionally, Bryant will discuss metrology, which is just starting to be possible at this level, due to the high precision manipulation systems and the granite bases of these new systems. The FF35 CT brings a new dimension to electronics X-ray, allowing users to benefit from technology revolutionary in our industry.
Manufactured in Germany, the YXLON FF35 CT brings NDT (Non-Destructive Test) expertise to the micro-electronics world, allowing wafer-level CT up to complete assembly CT, taken as a single image, but the operator can easily drill down to sub-micron level in the 3D reconstruction. Reconstruction happens in parallel, so it works very quickly, using market-leading software ensures even sub-micron features can be viewed and measured easily. The high-resolution FF35 CT system as well as the other Yxlon X-ray and CT systems dedicated for the electronics market can be visited at productronica booth 405 in hall A2. Visitors can bring parts in order to experience the capabilities of the Yxlon X-ray and CT systems.
Bryant has more than 25 years of successful experience at a senior level in technical sales, primarily in the X-ray field. He is responsible for all YXLON channels to market, and developing the company’s global sales team to be even closer to its customers, understanding their needs and reacting promptly.
About YXLON
YXLON International designs and produces radioscopic and CT inspection systems for the widest variety of applications and fields. Whether situated in the aviation & aerospace, automotive or electronics industry, our customers are among the largest producers, major enterprises that place their confidence in our quality worldwide.
The name YXLON stands for assurance and quality for all types of cast parts, tires, electronic components, turbine blades, welded joints and a lot more. Our product portfolio includes X-ray systems for installation in radiological inspection envelopes, universal X-ray inspection systems on the basis of fully shielded devices, as well as solutions specific to a customer. Whether in manual, semi or fully automated operation, our inspection systems are ideal for deployment in research & development and can be integrated into any production process.
With our FeinFocus product line we offer microfocus systems for detailed insights into even finer structures. If semiconductor packaging, BGA soldering joints on printed circuit boards, sensors or relays – with 2D or 3D inspection missing or damaged bonding wires, flawed soldering joints or splices as well as other manufacturing defects can be detected and their position and size defined according to requirements.
With our headquarters in Hamburg, sales and service locations in Tokyo, Osaka, Hudson (Ohio), San Jose (California), Beijing, Shanghai, Hattingen and Heilbronn, as well as a network of representatives in over 50 countries, as YXLON we’re local for our customers all over the world.
Since 2007, YXLON International has been a member of the Comet Group.
About Comet Group
The Comet Group is a globally leading, innovative Swiss technology company with a focus on the x-ray, radio frequency and ebeam businesses. With premium high-tech components and systems, we enable customers in numerous industries to both enhance the quality of their products and make their manufacturing more efficient and eco-friendly. Our innovative solutions under the Comet, Yxlon and ebeam brands are in demand for applications such as materials testing and security inspection, the coating and treatment of surfaces, and non-contact sterilization.
Based in Flamatt, Switzerland, the Comet Group has a presence in all world markets. We employ about 1,300 people worldwide, including almost 500 in Switzerland. Besides production facilities in China, Denmark, Germany, Switzerland and the USA, we maintain various subsidiaries in the USA, China, Japan and Korea. Comet’s stock (COTN) is listed on the SIX Swiss Exchange.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.