-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
EIPC SpeedNews: News from the European PCB Industry
November 7, 2017 | EIPCEstimated reading time: Less than a minute
- 50 Years of Service, a Century of Conferences, a Lifetime of Excellence
- Positive Operative Business Performance Continues at Schweizer
- Zollner invests in the first combined pick-and-place and dispensing unit from Essemtec
- iMaps UK Conference
- Microtech 2018
- Advanced Packaging Conference, November 14-15, 2017 in Munich
- ICT Evening Seminar, December 5, 2017
- BGA, QFN Fine Pitch Rework Experience Live, November 21, 2017
Suggested Items
PDR Offers Advanced Infrared Heating Technology for BGA Rework
12/02/2024 | PDRPDR Americas is proud to highlight its industry-leading solutions for BGA and SMT rework. As a trusted partner in electronics manufacturing, PDR’s rework stations deliver precision, reliability, and simplicity, setting a new standard for addressing the challenges of modern rework applications.
Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced
09/19/2024 | IPCIn conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13. Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 4
09/11/2024 | I-Connect007 Editorial TeamIn this chapter, readers will learn the importance of efficiency in post-SMT processes such as rework and testing. Key KPIs are discussed, along with the need to reduce rework time, improve first-pass yield, maintain testers, and monitor defect rates. By optimizing these processes, manufacturers can enhance product quality, reduce costs associated with defects, and ensure customer satisfaction.
Winners of the IPC Hand Soldering and Rework Competition Malaysia at Electronics Manufacturing Expo Asia (EMAX) 2024 Announced
07/29/2024 | IPCIn conjunction with Electronics Manufacturing Expo Asia (EMAX) 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Penang, Malaysia July 24-26, 2024. The competition welcomed 36 contestants from 14 well-known electronics companies, and one institution in Malaysia.
Winners of 2024 IPC Masters Competition China Announced
07/17/2024 | IPCFrom July 8-10, the 2024 IPC Masters Competition China was successfully held in Pudong, Shanghai. This year’s competition, was the largest in the history of the Greater China region, bringing nearly 400 electronics industry elites from 18 provinces and municipalities.