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Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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EIPC SpeedNews: News from the European PCB Industry
November 7, 2017 | EIPCEstimated reading time: Less than a minute

- 50 Years of Service, a Century of Conferences, a Lifetime of Excellence
- Positive Operative Business Performance Continues at Schweizer
- Zollner invests in the first combined pick-and-place and dispensing unit from Essemtec
- iMaps UK Conference
- Microtech 2018
- Advanced Packaging Conference, November 14-15, 2017 in Munich
- ICT Evening Seminar, December 5, 2017
- BGA, QFN Fine Pitch Rework Experience Live, November 21, 2017
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Rachael Temple - AlltematedSuggested Items
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.
BEST Inc. Provides High-Reliability BGA Reballing and Component Rework Services
08/22/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce its component rework services are available for all types of area array devices including ball grid array, land grid array and quad flat no-lead SMT packages.
A.R.T. Ltd. Nominated in Four Categories at 2025 Instrumentation and Electronics Industry Awards
08/11/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T. Ltd.), a leading provider of electronics training and consultancy, has been shortlisted in four categories at the 2025 Instrumentation and Electronics Industry Awards, including Industry Personality, Academic Support, Rising Star, and Best Customer Service.
Automated Production Equipment and Manncorp Announce Strategic Partnership to Expand SMT Solutions for U.S. Electronics Manufacturers
08/06/2025 | Automated Production EquipmentAutomated Production Equipment (APE), a trusted supplier of high-performance soldering and rework systems, proudly announces a strategic partnership with Manncorp, a leading provider of Surface Mount Technology (SMT) production equipment. This collaboration brings together two industry leaders to deliver expanded, end-to-end SMT solutions to electronics manufacturers across North America.
Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.