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More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025

09/01/2025 | Evelyn Cui, Global Electronics Association—East Asia
Nearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.

BEST Inc. Provides High-Reliability BGA Reballing and Component Rework Services

08/22/2025 | BEST Inc.
BEST Inc., a leader in electronic component services, is pleased to announce its component rework services are available for all types of area array devices including ball grid array, land grid array and quad flat no-lead SMT packages.

A.R.T. Ltd. Nominated in Four Categories at 2025 Instrumentation and Electronics Industry Awards

08/11/2025 | A.R.T. Ltd.
Advanced Rework Technology Ltd. (A.R.T. Ltd.), a leading provider of electronics training and consultancy, has been shortlisted in four categories at the 2025 Instrumentation and Electronics Industry Awards, including Industry Personality, Academic Support, Rising Star, and Best Customer Service.

Automated Production Equipment and Manncorp Announce Strategic Partnership to Expand SMT Solutions for U.S. Electronics Manufacturers

08/06/2025 | Automated Production Equipment
Automated Production Equipment (APE), a trusted supplier of high-performance soldering and rework systems, proudly announces a strategic partnership with Manncorp, a leading provider of Surface Mount Technology (SMT) production equipment. This collaboration brings together two industry leaders to deliver expanded, end-to-end SMT solutions to electronics manufacturers across North America.

Solving the Toughest BGA Challenges in Electronics

07/30/2025 | Nash Bell, BEST Inc.
Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.
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