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BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges

04/02/2025 | BEST Inc.
BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.

MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics

02/06/2025 | MacDermid Alpha Electronics Solutions
In an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026.

PDR Offers Advanced Infrared Heating Technology for BGA Rework

12/02/2024 | PDR
PDR Americas is proud to highlight its industry-leading solutions for BGA and SMT rework. As a trusted partner in electronics manufacturing, PDR’s rework stations deliver precision, reliability, and simplicity, setting a new standard for addressing the challenges of modern rework applications.

Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced

09/19/2024 | IPC
In conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13.  Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors. 

Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 4

09/11/2024 | I-Connect007 Editorial Team
In this chapter, readers will learn the importance of efficiency in post-SMT processes such as rework and testing. Key KPIs are discussed, along with the need to reduce rework time, improve first-pass yield, maintain testers, and monitor defect rates. By optimizing these processes, manufacturers can enhance product quality, reduce costs associated with defects, and ensure customer satisfaction.
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