Rogers Offers Efficient Cooling Solutions at SPIE Photonics West
January 10, 2018 | Rogers CorporationEstimated reading time: 3 minutes
Rogers Corporation’s Power Electronics Solutions (PES) group will once again contribute as a major exhibitor to one of the world’s largest events for photonic products and technologies: the upcoming SPIE Photonics West Conference and Exhibition. The conference and exhibition is scheduled for January 27 through February 1, 2018 in San Francisco’s Moscone Center.
Photonics West is the world’s largest multidisciplinary gathering for lasers, photonics, and biomedical optics products and technologies, with more than 20,000 visitors expected to attend the week-long 2018 event. Photonics West includes a scientific conference with more than 4500 technical presentations in three topic areas (biomedical optics and biophotonics, laser sources and lasers, and optoelectronic materials and devices). It also features two exhibitions: the BiOS Expo, with 200 companies showing products and services on biomedical optics, and the SPIE Photonics West 2018 Exhibition, where attendees can visit representatives from more than 1300 global suppliers of lasers and photonics. Among those, Rogers Power Electronics Solutions (PES) will be showing their innovative material solutions for enhancing the performance of lasers and photonics components and systems.
Rogers at Booth 4235
Representatives from Rogers Power Electronics Solutions (PES) group (Rogers Germany GmbH) will be a part of the SPIE Photonics West 2018 Exhibition, available at booth 4235 to show samples of their latest material-based products and to offer advice on how to apply those products to lasers and photonics designs for effective thermal management and extended operating lifetimes. Among the many Rogers PES products on display at booth 4235 will be its curamik® families of cooling products, such as curamik CoolPerformance Plus. This active water-cooled laser diode cooler effectively removes the heat from high-power laser diodes in the tightest spaces, helping to enhance power efficiency and extend operating lifetimes. These curamik CoolPerformance Plus coolers are formed from OFHC copper for excellent thermal conductivity and ceramic substrate for high isolation, combining for a tightly controlled coefficient of thermal expansion (CTE) of 6.5 to 7 ppm/K from +25 to +300°C.
In addition to curamik CoolPerformance Plus, Rogers PES will show examples of its curamik CoolPower and curamik CoolEasy material-based laser and photonics cooling solutions. The curamik CoolPower and CoolPower Plus coolers are fabricated with multiple layers of pure copper for effective thermal dissipation in the smallest volumes possible. The coolers benefit from the unique curamik bonding process to achieve hermetic multilayer structures without solder or additional adhesive layers. The curamik CoolEasy coolers are especially designed for conductive cooling of high-power laser diodes and laser diode bars. These copper coolers can be precisely machined and milled to meet the flatness requirements for mounting to laser diodes and avoiding potential “hotspots” in laser diode circuits.
PES Design Support Hub Resource for Engineers
Rogers PES brings its more than 40 years of experience together in a handy online resource that is available 24/7. The PES Design Support Hub features complete technical information on ROLINX® busbars and curamik ceramic substrates, a library of technical papers on product design and problem solving and helpful videos on products and power distribution topics. Registration for access is quick and free of charge. The Design Support Hub helps design engineers to increase power, manage heat, and ensure the quality and reliability of their devices for optimal new product design, for more information click here.
About Rogers Corporation
Rogers Corporation is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, e-Mobility and renewable energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.