The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
EIPC SpeedNews: News from the European PCB Industry
January 24, 2018 | EIPCEstimated reading time: Less than a minute
- Over 100 Registrations for the EIPC Winter Conference in Lyon. Still Possible to Register!
- Preview for IPC APEX Expo 2018
- Voice of IoT, DECT and ULE Industry Summit, February 7–8, 2018, Amsterdam
- Ventec Passes AS9100 Revision D Transition Audit in China and UK
- The 2018 ICT Annual Symposium, June 5, 2018, National Motor Museum
- 2018 Spring Seminar and AGM, Best Western Plus Manor Hotel, March 13, 2018
- Annual Foundation Course April 9–12, with the First Day at Merlin PCB, Deeside and then at Chester University
- Isola transfers ownership to investment group
- Smart Systems Integration 2018: Conference Registration at Early Bird Prices Until End of February
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Rachael Temple - AlltematedSuggested Items
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10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
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