-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Indium’s Sandy-Smith to Lead Panel at IPC APEX EXPO 2018
February 9, 2018 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the IPC APEX EXPO technical conference on Thursday, March 1 in San Diego, California.
The Buzz Session, led by Sandy-Smith, will start at 10:30 am on March 1 and cover Test Methods for Assessing Ionic Cleanliness. The electronics industry continues to search for updated test methods designed to accurately assess ionic cleanliness. While the incumbent Resistivity of Solvent Extract (ROSE) method is no longer considered the best method, emerging methods have yet to reach the level of industry standardization. Process, materials, and assembly experts will discuss the important factors to be considered when choosing the best method to test ionic cleanliness.
Panel participants include:
- David Lober, Process Chemist, Kyzen Corporation
- Douglas Pauls, Principle Materials Process Engineer, Rockwell Collins
- Jason Fullerton, Alpha Assembly Solutions
- Terry Munson, Foresite, Inc.
- Graham Naisbitt, Gen3 Systems
For more information about this session, click here.
Brook Sandy-Smith is a leader in the industry for technical knowledge and support. As a Technical Support Engineer based at Indium Corporation’s headquarters in Clinton, NY, she specializes in PCB Assembly Materials and works closely with customers to develop custom solutions and optimize their processes. Sandy-Smith has a passion for developing and implementing standardization for test methods, and is an SMTA Certified Process Engineer. She is active in several IPC committees, SMTA programs, and iNEMI projects, and currently serves as chair of the J-004 committee and as Vice President of technical programs for the SMTA Empire chapter. Brook graduated from the International Engineering Program at the University of Rhode Island with a degree in Chemical Engineering and German language.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
Suggested Items
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
North American EMS Industry Down 4% in March
04/29/2024 | IPCIPC announced the March 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.31.
Real Time with… IPC APEX EXPO 2024: A Global Presence in PCB Manufacturing
04/29/2024 | Real Time with...IPC APEX EXPORob DiGiovanni, VP of sales for the Americas at STARTEAM Global, discusses the company's global presence in PCB manufacturing. As he explains, the firm operates facilities across Europe, Asia, and North America, specializing in serving contract manufacturers in the automotive and medical industries. They emphasize quality and meeting OEM standards, focusing on offshore supply and non-Chinese factories in the North American market. The company has grown through acquisitions and rebranding to offer multiple products.