-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Rehm Showcases Innovative Systems at Leading Trade Fairs Worldwide
February 26, 2018 | Rehm Thermal SystemsEstimated reading time: 3 minutes
This year, Rehm Thermal Systems is being represented at the well-known international trade fairs and is showcasing the newest plant and systems engineering in the areas of reflow soldering with convection and condensation, as well as circuit board coating for producing electronics. Visit us in March at productronica China in Shanghai and AMPER in Brno or in April at ElectronTech in Moscow and NEPCON China in Shanghai.
March 14-16, 2018: productronica China, Shanghai
Started in Munich and developed further for the growing markets in China and India, the Munich trade fair, along with its subsidiaries abroad, has set up a global electronics network for the entire industry with the highest level of quality and professionalism. The global electronics community meets every year at the productronica trade fair to discover the newest innovations and trends, custom-made products for local markets and specific impulses and ideas for future industry development.
For the first time, Rehm is now also being represented at productronica China in Shanghai at the New International Expo Centre, with its own stand. Our trade fair team are looking forward to your visit to trade fair stand E2-2107.
March 20-23, 2018: AMPER, Brno, Czech Republic
AMPER, held in Brno in the Czech Republic, is one of the largest trade events for the electronics industry in Europe. Rehm Thermal Systems will also be there this year as an exhibitor and is presenting innovative solutions from the 20th - 23rd March 2018. As an established manufacturer of reflow soldering units with convection, condensation and vacuum, Rehm has already made a name for itself in the eastern European electronics market. Our team is showcasing our tried and tested reflow soldering system VisionXC on site in Hall F, stand 2.17. What’s impressive is its compactness, which brings together all important technological features in the smallest possible space. The VisionXC is the ideal convection soldering system for small and medium production batches, in the lab or for demo lines!
April 17-19, 2018: ElectrontechEXPO, Moscow
Once again, at the ElectrontechEXPO in Moscow, our customers have the chance to find out about the newest developments in the thermal system solutions sector by Rehm. The Rehm team, for the branch founded in 2015, are on site and are at the trade fair stand B 227 in pavilion 3 to advise the visitors extensively on innovations. For the first time, we will present the new contact soldering system Nexus to the Russian market. The vacuum soldering furnace from Rehm Thermal Systems is perfectly suited for production facilities operating in the flux and shrinkage-free soldering sector with various process gases. Unleaded and leaded pastes can also be used, as well as soldering forms with and without soldering flux. Miniaturisation in the Advanced Packaging and Semiconductor sector can be boosted further using the vacuum technology. Also being exhibited is VisionXC, the impressive reflow soldering system, which combines all important technological features in the smallest possible space.
April 24-26, 2018: NEPCON China, Shanghai
Rehm is also showcasing innovative plant engineering for producing electronics in the Asian region at NEPCON Shanghai.
NEPCON China is one of the biggest and most prominent electronics industry trade fairs in Asia. Leading companies come to Shanghai from all over the world to present innovations and the newest plant engineering in the electronics production sector. This year, Rehm Thermal Systems is presenting technological highlights of reflow convection soldering to visitors at stand 1F20.
About Rehm Thermal Systems
Having specialised in the field of thermal system solutions for the electronics and photovoltaics industry, Rehm is a technological and innovative leader in the state-of-the-art, cost-effective manufacturing of electronic assemblies. As a globally active manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for metallisation of solar cells as well as numerous customised systems, we are present in all key growth markets as a partner with more than 25 years of industry experience, allowing us to implement innovative production solutions that set new standards. For more information, click here.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.