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onsemi Selected to Power Volkswagen Group’s Next-Generation Electric Vehicles

07/22/2024 | onsemi
onsemi announced it has signed a multi-year deal with Volkswagen Group to be the primary supplier of a complete power box solution as part of its next-generation traction inverter for its Scalable Systems Platform (SSP).

Silicon Box Selects Piedmont to Host €3.2B Chip Foundry for Italian Expansion

07/02/2024 | Silicon Box
The co-founders of Silicon Box, CEO Dr. Byung Joon (BJ) Han, Dr. Sehat  Sutardja, and Weili Dai, together with the Minister Adolfo Urso, Presidente Alberto Cirio of  the Piedmont region, and Mayor Alessandro Canelli of the municipality of Novara  announced that Novara in Piedmont will be the site of the company’s new, first-of-a-kind  advanced semiconductor packaging and testing foundry.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/07/2024 | Andy Shaughnessy, Design007 Magazine
It’s been a great week. I spent part of the week at PCB East, which was held at the Boxboro Regency in Boxboro, Massachusetts. I haven’t been to Boxboro in about 20 years. The last time I was at PCB East in Boxboro, design instructor Mary Sugden had a hot plate and a supply of bologna in her room, because she preferred fried bologna to anything she could get in a restaurant. Never a dull moment with PCB designers! 

Polish Industrial Partners Complete Five Major Offsets Projects

05/09/2024 | Lockheed Martin
The Ministry of Defence officially approved five completed Offset projects in the first phase of the WISLA programme. Lockheed Martin partnered with local industrial partners to increase technical capabilities and provide manufacturing know-how of components related to Patriot Advanced Capability – 3 (PAC-3) Missile Segment Enhancement (MSE) and in support of Poland’s air and missile defence.

The Knowledge Base: A CM’s Perspective on Box Build Practices

04/30/2024 | Mike Konrad -- Column: The Knowledge Base
In the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
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