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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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RTW IPC APEX EXPO: Rogers' High-Frequency/High-Temp Substrates
March 26, 2018 | Real Time with...IPCEstimated reading time: Less than a minute

Tony Mattingly, senior product manager at Rogers Corporation, discusses the company's new substrates for high-frequency/high-temperature applications.
To watch the interview, click here.
Suggested Items
High-frequency EMC Noise in DC Circuits
05/29/2025 | Karen Burnham, EMC UnitedEMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.
Keysight Enabling University of Stuttgart to Advance 6G Integrated Circuits Research
08/10/2023 | Keysight Technologies, Inc.Keysight Technologies, Inc. is enabling the University of Stuttgart to conduct foundational research essential to development of new integrated circuits (IC) for 6G technology with the new Keysight 6G Vector Component Analysis (VCA) solution.
KSG Group Puts Horizontal OSP Line for Organic Surfaces into Operation
07/31/2023 | KSG GroupThe KSG Group has expanded its capacities in the field of organic surface coating by bringing a new wet-chemical horizontal system online.
Mil/Aero Design: Not Just Another High-Rel Board
07/25/2023 | Andy Shaughnessy, Design007 MagazineMeijing Liu, CID+, is a senior PCB designer for Microart Services, an EMS company in Markham, Ontario, Canada. She recently took a six-week military/aerospace PCB design class from IPC’s Kris Moyer, and she was surprised at how much content she was able to absorb in such a short time. I spoke with Meijing and we discussed some of her takeaways from the class, and how it has inspired her to pursue more design education in the future.
MACOM Awarded U.S. Air Force Contract for Advanced Semiconductor Development
07/20/2023 | Business WireMACOM Technology Solutions Inc., a leading supplier of semiconductor products, announced that it has been awarded a contract from the United States Air Force Research Laboratory (“AFRL”) to develop advanced semiconductor process technology related to Gallium Nitride-on-Silicon Carbide (“GaN-on-SiC”).