-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Inventec Performance Chemicals Upgrades Solder Powder Facilities
May 10, 2018 | Inventec Performance ChemicalsEstimated reading time: 2 minutes
Inventec Performance Chemicals USA LLC, producer of Inventec solder pastes, cleaning chemistries and Amtech branded solder products, has completed major production and laboratory upgrades to its solder powder making plant thanks to the support of the State of CT Department of Economic and Community Development and the Connecticut Center for Advanced Technology.
“Our partnership with the state of Connecticut has been instrumental to our ability to innovate for growth,” says David Reitz, Managing Director and CEO of Inventec Performance Chemicals USA LLC; “The upgrades to our facility has positioned us not only to expand our business with current customers but also to develop next generation products that continue to position us – and our costumers to be market leaders.”
The upgraded laboratories feature the latest in particle sizing and chemical analysis. The company’s new particle sizing equipment features state of the art image analysis and electrical resistance measurements. This allows the company to effectively and accurately perform distribution analysis ranging from 1-200 microns and encompasses solder powders from Type 1 through Type 8.
Chemical analysis of metals and alloys have also been upgraded through the acquisition of the latest in Spark OES technology. This technology allows the company to perform accurate analysis of all the latest alloys, including high-reliability alloys that contain various dopants. In addition to high-reliability applications, the company will be able to perform wave pot analysis for its customers with best-in-class reliability.
Key investments into production upgrades, has increased Inventec’s capacity and output for Type 3, 4 and 5 solder powders; “We take seriously the need to continue to deliver best-in-class capabilities for our customers. New sizing equipment and upgraded environmental controls will allow the company to double production while improving the stability of the powder in various fluxes -- leading to improved soldering and voiding properties.” says Michael Gesick, Global Metals Technology Manager for Inventec Performance Chemicals.
About Inventec Performance Chemicals USA LLC
For over 40 years, INVENTEC has been serving industrial markets with sustainable products and processes that reduce the total cost of ownership, delivering:
- Innovative solutions that feature uncompromising performance
- Environmental and health protection by substituting safer products for hazardous substances ahead of regulatory standards, and by developing intelligent risk management solutions for non-substitutable hazardous substances.
- Proximity of experts in more that 20 countries who provide expert consultation, resulting in optimized solutions that serve the total needs of our customers.
Inventec has 10 subsidiaries throughout Europe, Asia, USA and Mexico, including 7 production sites that are all ISO 9001 certified and equipped with state-of-the-art laboratories.
In 2014, Inventec expanded their presence across North America by adding AMTECH solder pastes, solder powders, and process support products, providing a highly complementary addition to the full line of INVENTEC products for the electronic assembly marketplace.
For more information, click here.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.