Chemists Create Faster and More Efficient Way to Process Information
May 11, 2018 | University of WaterlooEstimated reading time: 1 minute
University of Waterloo chemists have found a much faster and more efficient way to store and process information by expanding the limitations of how the flow of electricity can be used and managed.
In a recently released study, the chemists discovered that light can induce magnetization in certain semiconductors - the standard class of materials at the heart of all computing devices today.
"These results could allow for a fundamentally new way to process, transfer, and store information by electronic devices, that is much faster and more efficient than conventional electronics."
For decades, computer chips have been shrinking thanks to a steady stream of technological improvements in processing density. Experts have, however, been warning that we'll soon reach the end of the trend known as Moore's Law, in which the number of transistors per square inch on integrated circuits double every year.
"Simply put, there's a physical limit to the performance of conventional semiconductors as well as how dense you can build a chip," said Pavle Radovanovic, a professor of chemistry and a member of the Waterloo Institute for Nanotechnology. "In order to continue improving chip performance, you would either need to change the material transistors are made of - from silicon, say to carbon nanotubes or graphene - or change how our current materials store and process information."
Radovanovic's finding is made possible by magnetism and a field called spintronics, which proposes to store binary information within an electron's spin direction, in addition to its charge and plasmonics, which studies collective oscillations of elements in a material.
"We've basically magnetized individual semiconducting nanocrystals (tiny particles nearly 10,000 times smaller than the width of a human hair) with light at room temperature," said Radovanovic. "It's the first time someone's been able to use collective motion of electrons, known as plasmon, to induce a stable magnetization within such a non-magnetic semiconductor material."
In manipulating plasmon in doped indium oxide nanocrystals Radovanovic's findings proves that the magnetic and semiconducting properties can indeed be coupled, all without needing ultra-low temperatures (cryogens) to operate a device.
He anticipates the findings could initially lead to highly sensitive magneto-optical sensors for thermal imaging and chemical sensing. In the future, he hopes to extend this approach to quantum sensing, data storage, and quantum information processing.
Suggested Items
Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process
05/01/2024 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory has recently launched a collaboration with Toyota Motor North America that could reduce the nation’s reliance on foreign sources of battery materials.
Real Time with… IPC APEX EXPO 2024: Outlining Rehm's Innovations and Global Presence
05/01/2024 | Real Time with...IPC APEX EXPOMichael Hanke, the chief sales officer for Rehm Thermal Systems, shares insights on the North American market, new machinery, and software development. He also discusses Rehm's turnkey solutions, process flexibility, global presence, and the dedicated team of 700 employees working on global solutions.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow: