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The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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EIPC SpeedNews: News from the European PCB Industry
May 15, 2018 | EIPCEstimated reading time: Less than a minute
- Detailed Program for EIPC 50th Anniversary Conference, June 21–22, 2018
- SCHWEIZER Shows Successful Start into the New Fiscal Year
- Atotech to Present InPro THF for Advanced HDI and a Series of New Products for Flex/flex-rigid PCBs at C'Tex 2018
- Printed Circuit Broker Elmatica Launches First Step Towards a Digital Supply Chain
- Simon Rowe Joins Spirit Circuits to Help Drive Value-Added Resale PCB Sales
- The 2018 ICT Annual Symposium, June 5
- UK Starts £11 Million Project to Revolutionize Electronics
- Ventec Launches Dk 3.48 Ceramic-Filled Hydrocarbon Thermoset Material
- The Irresistible Appeal of Automotive Electronics
- Trump Administration will Allow AI to ‘Freely Develop” in U.S.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
EIPC Summer Conference 2025: PCB Innovation in Edinburgh
04/18/2025 | EIPCEIPC have very wisely selected this wonderful city in Scotland as the venue for their Summer Conference on June 3-4. Whilst delegates will be distilling the proven information imparted by the speakers in the day, in the evening they will be free spirits at the Conference Dinner.
EIPC Summer Conference 2025: Call for Distinguished Speakers in Edinburgh
03/26/2025 | EIPCThe European Institute of Printed Circuits (EIPC) is pleased to announce its Summer Conference 2025, scheduled for June 3-4 in the historic city of Edinburgh, Scotland.
EIPC Winter Conference to Explore Latest Trends in Electronics Manufacturing
12/31/2024 | EIPCThe European Printed Circuit Association (EIPC) is pleased to announce its upcoming Winter Conference, scheduled for February 4-5, 2025, at the DoubleTree by Hilton Hotel in Luxembourg City.