Dan’s Biz Bookshelf ‘House of Huawei'
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
Facing the Future: Challenges and Opportunities in Reshoring PCB Manufacturing
Updated Program for EIPC 50th Anniversary Conf Now Available
May 22, 2018 | EIPCEstimated reading time: 1 minute
The past, the present and the future—these the three elements of EIPC’s 50th anniversary conference being held in Dusseldorf in June this year. Half a century has passed since EIPC was founded in the days when the PCB was more than just a commodity.
At the upcoming conference to be held in Dusseldorf, Germany, there will be a first-class show on June 21–22, with the conference on Day 1 culminating with a visit to Unimicron’s new multilayer factory in Geldern, the Tate Modern of the European PCB industry. This will be followed by a celebration dinner at the 14th Century listed and moated Walbeck Castle.
Day 1 will be the occasion in which Paul Waldner looks back over 50 years in the industry, while Hans Friedrichkreit unveils his metric crystal ball to compete with the imperial one that Walt Custer usually produces. From then on, there will be a wealth of technological discussions on topics such as traceability, PCB 4.0, and halogen-free laminates.
Day 2 is dedicated to flex for 5G, curved and stretchable PCBs, open-source language, organic surface preservatives, and lab-on-PCB technology, as well as the traditional glimpses into developments in applications, chemistries and supply chain management.
For the updated detailed conference program, click here.
For the conference registration form, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
IPC Issues Call for Participation for IPC APEX EXPO 2026
06/02/2025 | IPCIPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2026.
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
05/28/2025 | Mike Konrad -- Column: The Knowledge BaseMembership in trade associations like the Surface Mount Technology Association (SMTA) offers substantial benefits that can significantly enhance a professional's career in the electronics manufacturing industry. These advantages encompass extensive networking opportunities, access to specialized technical conferences, and complimentary training programs, all contributing to professional growth and industry recognition.
EWPTE 2025: Wire Processing Innovation Driving Technical Dialogue
05/13/2025 | Brittany Martin, I-Connect007From cutting-edge automation to advanced testing and harness assembly solutions, the 2025 Electrical Wire Processing Technology Expo (EWPTE) delivered a packed exhibit floor, robust technical programming, and valuable peer-to-peer connections.