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Zestron Academy to Host Free Cleaning for Reliability Webinar
July 10, 2018 | ZESTRONEstimated reading time: 1 minute
Zestron will host the "Cleaning for Reliability - Overcoming Challenges for Class III Assemblies" webinar on July 26, from 1:30 PM to 2:30 PM EDT. This is the fifth installment of the Zestron Academy 2018 Cleaning Webinar Series, and will be presented by Senior Application Engineer Ravi Parthasarathy, M.S.Ch.E.
When designing Hi-Rel electronic assemblies, functionality is critical and long-term reliability is essential. This webinar provides an overview of the various failure mechanisms including the challenges associated with improper cleaning, board complexity, material mix, component and package types used. Steps to reduce the risk of failure and improve the long-term reliability will be presented. Case studies will be reviewed.
"We invite both new and experienced industry members to attend this free webinar as we'll review the importance of understanding the failure mechanisms and corrosion types to resolve cleanliness issues," said Sal Sparacino, Sales and Marketing Manager, Zestron Americas.
About ZESTRON
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With eight worldwide technical centers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
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U.S. Companies Invest Heavily in Robots
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USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.