Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
Altus Supports Next Generation Equipment
July 18, 2018 | Altus GroupEstimated reading time: 1 minute
As the sea change to a SMART manufacturing ideal escalates, and with the development of next generation capital equipment already underway, Altus Group is preparing for this progression with its choice of suppliers all of which are at the cutting edge of technology.
One company that is fully embracing Industry 4.0 is Altus’ pre-eminent supplier, Rehm Thermal Systems with the introduction of ViCI (Virtual Communication Interface) a portal for maintenance support in modern electronics production.
As leading innovators in plant engineering, Rehm is addressing the issue of Industry 4.0. with innovative concepts which support worldwide Augmented Reality to make maintenance, documentation and on-the-job-training easier. These new systems will help to reduce travel costs, increase worldwide availability and shorten response times.
Joe Booth, sales manager at Altus said: “All of our suppliers are stepping up to the plate when it comes to pioneering Industry 4.0 innovation. Products like Rehm Thermal Systems’ ViCI is ground-breaking and will help to change the production process for the better.
“The innovative portal solution offers concrete support with the help of smart glasses, guided maintenance scenarios on tablet or smartphone as well as a comprehensive and expandable knowledge base. Since it was first introduced at SMT Hybrid & Packaging show in Germany earlier this year, Altus has received many enquiries from customers interested in ViCI. Rehm’s new portal will help to reduce machine downtime and costly service visits and so ensuring maximum system availability at all times – this of course is a very attractive concept.”
The ViCI is currently being tested and developed in collaboration with pilot customers, and once available worldwide will be offered by Altus.
About Altus Group Ltd
Altus Group was formed in 2001 to support the UK and Irish market for Surface Mount Technology, capital equipment for every process, peripheral equipment, spares and consumables and most importantly excellent service support.
The Altus Group product line has evolved over the years with carefully selected suppliers who offer ‘best in class’ products at cost effective prices, from world leading brands.
The Altus Team has a network of highly skilled technical sales specialists, applications and service engineers, providing local support across the UK and Ireland.
In 2005 sister company Danutek was formed with offices in Hungary and Romania to service the needs of local customers and multi-national companies with manufacturing facilities in the Central and Eastern European marketplace. For more information, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System
04/15/2026 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.
HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots
04/15/2026 | PRNewswireHYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology
04/14/2026 | PRNewswireCarbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.