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Signal Integrity Meets Additive Innovation in the Latest Issue of I-Connect007 Magazine

05/18/2026 | I-Connect007 Editorial Team
Signal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing Editor Marcy LaRont explains, achieving electrical performance targets doesn’t stop at design; it depends heavily on how boards are fabricated, particularly through precise metallization processes.

Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’

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There’s a dangerous misconception among engineers who still think ceramic circuits are just a little tougher version of a PCB, a little better at handling heat, and a premium option when FR-4 starts to struggle. That thinking will cost you performance and reliability; in some applications, it may cost you the entire design. Remtec builds are not “better PCBs,” but fundamentally different platforms. Here are eight “truths” to demonstrate that difference.
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