Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Nordson Test and Inspection Announces AOI and X-ray Lineup for SMTAI
September 19, 2018 | NordsonEstimated reading time: 1 minute
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation, will exhibit in Booth #207 at SMTA International, scheduled to take place October 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois. The Nordson Test and Inspection team will showcase a suite of award-winning systems including the Quadra 7 x-ray inspection system, Nordson YESTECH FX-940 Ultra AOI and FX-940-UV AOI.
Nordson DAGE’s flagship system – the new Quadra 7 represents the cutting-edge of X-ray inspection performance. 6.7 MP ultra-high quality images are displayed at full one-to-one resolution over two 4K UHD monitors ensuring you see the clearest features today, and for all your products in the future.
Nordson YESTECH’s FX-940UV makes inspection of conformal coatings simple and convenient by automating the inspection process. The system inspects for quality and consistency of coating coverage under proprietary ultra violet lighting with the use of proprietary inspection algorithms. An optional coating thickness measurement package also is available.
The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices. With its Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-color digital image processing and both image and rule-based algorithms, the FX-940 ULTRA offers complete inspection coverage with unsurpassed 2D and 3D defect detection.
About Nordson Test and Inspection
Nordson DAGE, MATRIX, SONOSCAN and YESTECH, units of Nordson Corporation, manufacture and support a complete range of industry leading Test and Inspection products for the electronics industry. Offering an award winning portfolio of Acoustic Micro Imaging (AMI), Automated Optical Inspection (AOI), Automated X-ray Inspection (AXI), Manual X-ray Inspection (MXI), Bond Testing, Micro Materials Testing and Wafer X-ray Metrology systems, Nordson’s family of Test and Inspection products bring powerful and cost effective solutions to the Printed Circuit Board Assembly (PCBA) and Semiconductor industries.
About NORDSON
Nordson Corporation engineers, manufactures and markets differentiated products and systems that dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, test and inspect for quality, and treat and cure surfaces, and are supported by application expertise and direct global sales and service. Nordson serves many consumer non-durable, durable and technology end-markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954, headquartered in Westlake, Ohio, Nordson has operations and support offices in nearly 40 countries
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Redefining Solder Paste Application – Essemtec Reaches 1.1 Million Dots per Hour
11/06/2025 | EssemtecEssemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, announces a major performance upgrade to its Jet-on-the-Fly High Speed solder paste jetting technology, now achieving 1.1 million dots per hour.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.