Learning With Leo: What Is the Cost of Quality Brought About by Training?
Nolan’s Notes: A Tribute to Iola—and Automation
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
Redefining Solder Paste Application – Essemtec Reaches 1.1 Million Dots per Hour
November 6, 2025 | EssemtecEstimated reading time: 1 minute
Essemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, announces a major performance upgrade to its Jet-on-the-Fly High Speed solder paste jetting technology, now achieving 1.1 million dots per hour. This new milestone sets a benchmark for high-mix, low-to-mid volume production, redefining how manufacturers approach precision solder paste application.
Designed for flexibility, accuracy, and digital manufacturing efficiency, Essemtec’s solder paste jetting solution is available on all platforms — the Spider and Tarantula dispensing systems, and the FOX Ultra and PUMA Ultra All-in-One machines.
With Essemtec’s intelligent Gerber file import, users can move from digital design to production in no time, as recipes can be automatically prepared for any new project, eliminating manual programming and setup delays.
Two Ways to Use Solder Paste Jetting
Complement Your Stencil Printer – For Complex or Selective Applications
- Eliminate stepped stencil designs
- Apply solder exactly where needed
- Perfect for ultra-fine pitch and special components
Replace the Stencil Printer Entirely – For a Fully Digital, Stencil-Free Process
- No tooling, no cleaning, no delays
- Less waste, instant product changeover
- Ideal for high-mix SMT lines and prototype-to-production workflows
- Solder Paste application in cavities or different Z-levels seamlessly
Technical Performance
The upgraded Jet-on-the-Fly system delivers up to 1.1 million dots per hour at peak frequency. In real production conditions, users can achieve an average of 350,000 dots per hour on typical boards and up to 665,000 dots per hour on dense BGA patterns. Each dot can be dispensed with volumes between 1.8nL to 80nL, ensuring perfect repeatability and accuracy across every pad and component.
With jetting performance capable of feeding Pick & Place systems up to 50,000 cph, Essemtec’s solder paste jetting technology offers unmatched process integration — from prototyping to full-scale production.
Meet Essemtec at Productronica
Experience Essemtec’s high-speed solder paste jetting in live demos at Productronica 2025 – Booth A3.261 – Munich, Germany
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Real Time with... productronica 2025: Enhancing Manufacturing With Conformal Coatings From MacDermid Alpha
12/04/2025 | Real Time with...productronicaSaskia Hogan, global product manager for conformal coatings at MacDermid Alpha Electronics Solutions, discusses the role of coatings in improving manufacturing efficiency and sustainability. She addresses challenges faced by customers, such as harsher environments and cost pressures, while emphasizing the need for high reliability in critical applications.
Indium is Electrifying the Future with Advanced Materials Solutions at productronica
11/11/2025 | Indium CorporationAs one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at Productronica, taking place November 18-21, in Munich, Germany.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Indium Features Next-Generation Materials for Semiconductor Assembly at IMAPS
09/29/2025 | Indium CorporationIndium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.