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October 4, 2018 | SMTAEstimated reading time: 1 minute
Industry-leading associations IPC and SMTA will jointly hold the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Matt Kelly of IBM and Dale Lee of Plexus will be the keynote presenters at the conference.
Kelly, Senior Technical Staff Member at IBM Systems, will deliver the Day 1 keynote titled, “Bottom Termination Component Technology: Guidance for Design, Assembly, Quality, and Reliability of BTC Devices.” As BTC package sizes continue to shrink, power requirements continue to increase. Reliable packages require an appropriate amount of solder paste and solder joint reliability. Other variables such as surface finish, stencil selection, cleanliness, and thermal profile are vital factors.
Lee, Senior Staff DFX Strategy Engineer at Plexus Engineering Solutions, will deliver the Day 2 keynote titled, "Designing Electronics to Survive Harsh Conditions." As devices miniaturize, there is growing concern of flux residue and its influence on reliability. When flux residue becomes trapped under low stand-off devices, it may contain an unevaporated solvent, live activators and metal complex intermediates that may impact reliability. Designing for Excellence to achieve high reliability becomes more challenging.
Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.
The link provides a detail agenda outline.
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